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Chemical copper plating solution and preparation method and application thereof

A technology of electroless copper plating and complexing agent, applied in liquid chemical plating, coating, instruments, etc., can solve the problem of poor conductivity of silver paste, and achieve the effect of smooth copper surface, good bonding force and dense structure

Pending Publication Date: 2021-12-10
上海天承化学有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In terms of the current application of the main nano-silver paste and copper grid, the nano-silver paste uses exposure and development of the groove lines to fill the silver paste. This process is affected by uncertain factors such as the depth-to-width ratio of the groove and the filling rate. copper meshmetal

Method used

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  • Chemical copper plating solution and preparation method and application thereof
  • Chemical copper plating solution and preparation method and application thereof
  • Chemical copper plating solution and preparation method and application thereof

Examples

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Comparison scheme
Effect test

Embodiment 1-6

[0035] A kind of electroless copper plating liquid, according to mass concentration meter, described electroless copper plating liquid is made up of the described component of table 1 that is dissolved in deionized water, specifically as follows:

[0036] Table 1

[0037]

[0038]

[0039] The preparation method of above-mentioned electroless copper plating solution comprises the steps:

[0040] Dissolve the complexing agent with deionized water, add copper sulfate pentahydrate while stirring, adjust the pH with a pH regulator after dissolving, then add stabilizer, toughening agent and accelerator and stir evenly; finally add reducing agent and stir evenly, Obtain the electroless copper plating solution.

Embodiment 7

[0042] The difference between this embodiment and embodiment 1 is that the reducing agent is replaced by sodium hypophosphite, and the rest are the same as in embodiment 1.

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Abstract

The invention relates to a chemical copper plating solution and a preparation method and application thereof. The chemical copper plating solution comprises, by mass concentration, 5-20 g / kg of copper sulfate pentahydrate, 2-20 g / kg of a reducing agent, 20-100 g / kg of a complexing agent, 0.001-0.02 g / kg of a stabilizer, 0.001-0.02 g / kg of a flexibilizer, 0.001-0.02 g / kg of an accelerator, 10-20 g / kg of a pH adjusting agent and deionized water which are dissolved in deionized water; and the complexing agent is tetrahydroxypropyl ethylenediamine. The chemical copper plating solution is high in activity and good in stability, and a metal copper grid can be formed by the chemical copper plating solution to replace traditional ITO.

Description

technical field [0001] The invention relates to the technical field of plating solutions, in particular to an electroless copper plating solution and its preparation method and application. Background technique [0002] The market demand for touch panels of different sizes and applications in different fields is increasing. At present, traditional ITO applications are the main application, but ITO has problems such as not being able to be used for bending applications, poor transmittance, and poor conductivity. [0003] Metal Mesh technology utilizes metal materials for graphic conduction. In terms of the current application of the main nano-silver paste and copper grid, the nano-silver paste uses exposure and development of the groove lines to fill the silver paste. This process is affected by uncertain factors such as the depth-to-width ratio of the groove and the filling rate. Copper grid metal. The copper grid mainly adopts letterpress printing and additive chemical de...

Claims

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Application Information

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IPC IPC(8): C23C18/40G06F3/041
CPCC23C18/405G06F3/0412Y02P10/20
Inventor 黄亚运李晓红章晓冬王亚君刘江波
Owner 上海天承化学有限公司
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