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Low-residual and low-corrosivity aluminum soft soldering tin paste and manufacturing method thereof

An aluminum soldering and low-corrosion technology, applied in welding equipment, welding media, manufacturing tools, etc., can solve problems such as large residue, uncertainty, and corrosion of solder joints, and achieve good storage, low corrosion, and welding Effect with little residue

Active Publication Date: 2015-05-20
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the "tin powder" mentioned in the examples of its patent documents is too general, and it does not specify whether the "tin powder" is "pure tin powder" or "tin alloy powder", and there is obvious uncertainty in implementation; and this Solder paste also has the problems of more residue after soldering and serious corrosion of solder joints

Method used

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  • Low-residual and low-corrosivity aluminum soft soldering tin paste and manufacturing method thereof
  • Low-residual and low-corrosivity aluminum soft soldering tin paste and manufacturing method thereof
  • Low-residual and low-corrosivity aluminum soft soldering tin paste and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] A low-residue and low-corrosion aluminum soldering solder paste, the solder alloy powder is Sn3.0Ag0.5Cu, and the components in the solder paste are as follows by weight percentage:

[0038]

[0039] Preparation method: dilute tetrahydroxypropyl ethylenediamine and hydrofluoric acid with absolute ethanol to about 60% and 30% mass fraction respectively; gradually drop the diluted hydrofluoric acid into the diluted tetrahydroxypropyl ethyl diamine solution until the pH is 5.5; then the titrated solution was evaporated at 120°C for 2 hours, and tetrahydroxypropylethylenediamine hydrofluoride was obtained after cooling.

[0040] Weigh 99.0 grams of hydroxypropyl ethylenediamine hydrofluoride and put it into the reaction kettle, heat it to 150 ° C, make it melt completely and keep the temperature constant; then add 21.0 grams of zinc oxide, fluoride 9.0 grams of tin, 5.5 grams of polyisobutylene, 5.0 grams of hydrogenated castor oil, 0.5 grams of benzotriazole, stir evenl...

Embodiment 2

[0042] A low-residue and low-corrosion aluminum soldering solder paste, the solder alloy powder is Sn-58Bi, and the components in the solder paste are as follows by weight percentage:

[0043]

[0044] Preparation method: Dilute tetrahydroxypropylethylenediamine and hydrofluoric acid with absolute ethanol to a mass concentration of 40% and 15% respectively; gradually drop diluted hydrofluoric acid into diluted tetrahydroxypropylethylenediamine amine solution until the pH is 7.0; then the titrated solution was evaporated at 100°C for 5 hours, and tetrahydroxypropylethylenediamine hydrofluoride was obtained after cooling.

[0045] Weigh 210.0 grams of hydroxypropyl ethylenediamine hydrofluoride and put it into the reaction kettle, heat it to 135 ° C, make it melt completely and keep the temperature constant, then add 15.0 grams of zinc fluoride, boron fluoride to the molten acid ammonium salt 15.0 grams of stannous chloride, 5.0 grams of polyethylene glycol 200, 2.5 grams of ...

Embodiment 3

[0047] A low-residue and low-corrosion aluminum soldering solder paste, the solder alloy powder is Sn-37Pb, and the components in the solder paste are as follows by weight percentage:

[0048]

[0049] Preparation method: Dilute tetrahydroxypropyl ethylenediamine and hydrofluoric acid with absolute ethanol to a mass concentration of 50% and 22% respectively; gradually drop the diluted hydrofluoric acid into the diluted tetrahydroxypropyl ethylenediamine amine solution until the pH is 6.5; then the titrated solution was evaporated at 110°C for 3.5 hours, and tetrahydroxypropylethylenediamine hydrofluoride was obtained after cooling. Weigh 65.0 grams of hydroxypropylethylenediamine hydrofluoride and put it into the reaction kettle, heat it to 120°C, make it melt completely and keep the temperature constant, then add 10.0 grams of zinc fluoroborate, chloride 5.0 grams of zinc, 9.0 grams of tin bromide, 5.0 grams of polyethylene glycol 1000, 5.0 grams of polyethylene wax, and 1...

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Abstract

The invention discloses a low-residual and low-corrosivity aluminum soft soldering tin paste and a manufacturing method of the low-residual and low-corrosivity aluminum soft soldering tin paste. The aluminum soft soldering tin paste is composed of tin-based solder alloy powder and soldering flux. The tin-based solder alloy powder accounts for 75.0-90.0% of the weight of the tin paste. The soldering flux comprises, by weight, 6.0-21.0% of tetrahydroxypropyl ethylenediamine hydrofluoride, 0.5-5.0% of metal salt film-forming agent, 0.2-4.0% of organic thickening agent, 0.2-2.0% of thixotropic agent and 0.01-0.25% of corrosion inhibitor. The tin paste has the advantages of being good in spreadability, small in post-welding residual quantity, low in corrosivity and the like, and is suitable for soldering of electronic and electrical appliances and aluminum structures and parts in the household appliance industry and especially suitable for direct surface mounting welding of board-level-packaged chip assemblies and aluminum radiating substrates in LED lighting and soldering of aluminum radiators or heat exchange equipment, the automation of the welding process can be easily achieved, and the high radiating efficiency and high reliability of weldments can be obtained.

Description

technical field [0001] The invention relates to a material for low-temperature soldering of aluminum, in particular to a solder paste for low-temperature soldering of aluminum with low residue and low corrosion after welding and a preparation method thereof. The solder paste is suitable for LED Direct surface mount brazing connection between chip components and aluminum heat dissipation bases in board-level packaging in the lighting industry. It can also be used for low-temperature soldering of aluminum products and structures in the electronics and home appliance industries, as well as aluminum radiators or heat exchange equipment. weld. technical background [0002] Due to the high cost of copper and the price of copper is greatly affected by market fluctuations, the application of aluminum in the electronics manufacturing industry has attracted more and more attention. Aluminum not only has good electrical and thermal conductivity, but also has suitable strength, better ...

Claims

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Application Information

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IPC IPC(8): B23K35/363B23K35/40
CPCB23K35/362B23K35/40
Inventor 张新平周敏波丘富顺张浪马骁
Owner SOUTH CHINA UNIV OF TECH
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