Normal-temperature chemical tinning solution

A tin plating solution and chemical technology, applied in liquid chemical plating, metal material coating process, coating, etc., can solve the problems of poor stability of plating solution, large consumption, high operating temperature, etc.

Inactive Publication Date: 2013-02-13
NANJING DADI REFRIGERATION FOOD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, electroless tin plating is at a high temperature of about 90°C, through a mixed solution of hydrochloric acid and tin protochloride, to deposit a chemical tin layer on the surface of nickel, copper or copper alloy. This process has high operating temperature and harsh working environment, and due to The rapid volatilization of hydrochloric acid makes the plating solution poor in stability and consumes a lot

Method used

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Examples

Experimental program
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Embodiment Construction

[0007] The present invention will be further described below.

[0008] Add 70% measured pure water into the plating tank, then add 20g / L sodium hydroxide, after completely dissolving, add 12g / L tetrahydroxypropyl ethylenediamine, 8g / L HEDP (hydroxyl ethylidene diphosphonic acid), 5g / L of sodium citrate, 10ppm of 2,2-bipyridine, 1g / L of Tween 80 and 1g / L of polyethylene glycol 3000, stirred and dissolved, and finally added the remaining amount of pure water.

[0009] After the workpiece of copper metal, copper-tin alloy or nickel metal is activated by dilute sulfuric acid and washed with water, it is immersed in the above chemical tin plating solution at 25°C, and deposited for 10-30s to obtain a dull silver-white metallic tin coating.

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Abstract

The invention discloses a normal-temperature chemical tinning solution which comprises the following components: 5-10 g / L stannous chloride, 15-30 g / L sodium hydroxide, 10-15 g / L tetrahydroxypropyl ethylenediamine, 5-10 g / L HEDP (hydroxyethylidenediphosphonic acid), 5-10 g / L sodium citrate, 5-15 ppm 2,2-dipyridine, 0.5-2 g / L Tween-80, 1-2 g / L polyethyleneglycol 3000 and the balance of pure water. The invention can deposit lusterless silver-white chemical tinned layer on the surface of metal, such as copper, copper-tin alloy, nickel or the like, under normal temperature conditions.

Description

[0001] Technical field [0002] The invention is a field of electroplating chemistry, especially chemical tin plating. Background technique [0003] At present, at a high temperature of about 90 ° C, chemical tin plating pain, through the mixed solution of hydrochloric acid and chlorine chloride, seizes the chemical tin layer on the surface of nickel, copper, or copper alloy.The rapid volatilization of hydrochloric acid makes the plating fluid stable and the consumption is large. Invention content [0004] The purpose of invention: In order to overcome the deficiencies in existing technologies, the present invention provides a kind of normal temperature chemical tin plating, which can be achieved at room temperature at room temperature. [0005] Technical solution: In order to solve the above technical problems, the present invention uses the following technical solutions: a component of the following quality chemical tin plating liquid, including the following mass percentage: ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/52C25D3/30C25D3/32
Inventor 陈大弟
Owner NANJING DADI REFRIGERATION FOOD
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