3results about How to "Prevent heat conduction" patented technology

The present application provides a laminated body having excellent thermal conductivity, lightness and rigidity, and an integrated molded body in which the laminated body is integrated with other components. The integrated molded body of the present application is an integrated molded body in which a structure formed of a thermoplastic resin and a reinforcing fiber is arranged on the outer peripheral portion of a laminated body in which at least a prepreg formed of a continuous carbon fiber and a resin is laminated, and the thermal conductivity λ1A in the fiber direction of the continuous carbon fiber of the first prepreg constituting the outermost layer of the laminated body is 100 [W / (m·K)] or more and 800 [W / (m·K)] or less. It is preferably used for an electronic device housing.

The utility model discloses a book printing centralized ink supply device, including base, the base top fixedly connected with ink cylinder, the ink cylinder top is equipped with the cylinder cover, be equipped with the anti -solidification part in the ink cylinder, be equipped with the moving part between cylinder cover and base, the anti -solidification part includes the heating cavity of setting in the ink cylinder inner wall, with the fixed connection of heating cavity top one side oiling pipe, with the pipe cover of oiling pipe top connection, with the fixed connection of the oil discharge pipe of heating cavity bottom one side and with the control valve of oil discharge pipe outside fixed connection, the utility model discloses a base, ink cylinder, cylinder cover and anti -solidification part are set up, have solved the ink supply device of current when using, although can supply ink, but the ink is easy to solidify and deposit in the ink barrel, although can heat the ink through the heating plate, but its heating is not enough uniform, lead to ink dissolution speed slow, thereby lead to the problem of reduced practicality.

The invention relates to a reagent temperature control device and method, and relates to the technical field of digital microfluidics, the reagent temperature control device comprises a digital microfluidics unit, a temperature control unit and at least one power unit, the digital microfluidics unit is provided with a reaction chamber; the temperature control unit is connected with the digital micro-fluidic unit and is provided with at least one temperature control flow channel communicated with the reaction chamber, and the temperature control unit is configured to heat or cool liquid drops in the temperature control flow channel; the power unit is configured to move the liquid drops from the reaction chamber to the temperature control flow channel or move the liquid drops from the temperature control flow channel to the reaction chamber. Compared with the prior art, the problem of reagent heating can be effectively solved, the independently arranged temperature control unit is higher in heating efficiency and shorter in heating time, and the temperature consistency of liquid drops is better. And meanwhile, the problem that the pipetting performance of the chip is reduced due to the fact that the reagent is adhered to the surface of the digital micro-fluidic chip during heating is solved.