Polyimide film and preparation method thereof

Abstract

The invention provides polyimide film. The polyimide film is prepared by subjecting a polyamide acid solution compound to casting and imidization stretching, and the polyamide acid solution compound is mainly prepared by mixing the following components in parts by weight: 100-150 parts of polyamide acid resin, 5-20 parts of a plasticizer, 0.5-10 parts of a slipping agent and 50-125 parts of heat-conducting slurry. The prepared polyimide film is high in heat-conducting performance, excellent in mechanical performance, and easy in machine shaping and industrial production, and has wide application prospects in the aspect of interface heat-conducting insulating materials. The invention further provides a preparation method of the polyimide film; the preparation method has the advantages of short technology process, simple operation, low cost, environment friendliness, and suitability for large-scale production.

Description

technical field [0001] The invention belongs to the field of polymer composite materials, in particular to a polyimide film and a preparation method thereof. Background technique [0002] Polyimide (PI) film has been widely used in microelectronic integrated circuits, flexible printed circuit substrates, rail transit, aviation, etc. due to its excellent thermal stability, electrical insulation, mechanical properties and dielectric properties. Aerospace and other fields. However, the thermal conductivity of traditional polyimide film is only about 0.16W / (m·K), and its thermal conductivity is poor. When it is applied to high-density and high-speed operation of microelectronic devices, it is easy to cause circuit overheating, which affects components and components. The stability of integrated circuits, therefore, requires the development of a highly thermally conductive polyimide film that provides an ideal heat conduction and control scheme for microelectronic integrated com...

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Problems solved by technology

When the amount of inorganic thermally conductive fillers dispersed in the resin is small, although the fillers are evenly dispersed in the resin, they cannot form mutual contact and interaction with each other, and the thermal conductivity is not improved much; The filler prevents the movement of molecular chains in the polymer, resulting in a decrease in the toughness of the matrix itself. On the other hand, the expansion of cracks between the inorganic thermally conductive filler and the matrix under the action of an applied load will cause the material to fracture and fail.

Therefore, although filling a large amount of inorganic heat-conducting filler can greatly improve the thermal

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