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Preparation method for polyimide film used for graphite sintering

A polyimide film, graphite technology, applied in chemical instruments and methods, inorganic chemistry, non-metallic elements, etc., can solve the problems of large thermal shrinkage of sintered graphite, uneven thermal conductivity of graphite film, and many wrinkles, and achieve the surface smooth effect

Active Publication Date: 2019-09-24
富优特(山东)新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a preparation method of polyimide film for graphite sintering, which avoids the problems of wrinkled graphite film and low thermal conductivity caused by heat shrinkage and structural problems of polyimide film, and solves the problem of sintering graphite heat. Shrinkage, more wrinkles, low thermal conductivity, etc.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] A preparation method for polyimide film for graphite sintering, comprising the steps of:

[0022] (1) Take 100.12kg ODA and dissolve it in 900kg DMAC, take 109.6kg PMDA and add it to ODA dissolved in a polar solvent for resin synthesis. Boron flake particles are uniformly dispersed during the resin synthesis process, the resin synthesis temperature is controlled not to exceed 65°C, the resin synthesis time is 6 hours, the dispersion time after adding the thermal conductive material is not less than 2 hours, and the final molar ratio of anhydride to amine is controlled at 0.985: 1. The final viscosity is controlled at 120pa.s, the viscosity adjustment time is 4h, and the resin temperature is controlled within 30-60°C during the whole viscosity adjustment process;

[0023] (2) After the resin synthesized in step (1) is degassed and filtered, it is evenly coated on the surface of the running steel belt by a scraper knife, and dried at 180°C to form a film. After the film i...

Embodiment 2

[0029] A preparation method for polyimide film for graphite sintering, comprising the steps of:

[0030] (1) Dissolve 100.12kg of ODA and 54.07kg of PDA in 1500kg of DMAC, take 218.12kg of PMDA and add it to ODA and PDA dissolved in a polar solvent for resin synthesis, add 1.3kg of silicon carbide particles with a particle size of 100nm after the resin is viscous, Silicon carbide particles are uniformly dispersed during the resin synthesis process, the resin synthesis temperature is controlled not to exceed 65°C, the resin synthesis time is 6 hours, the dispersion time after the thermal conductive material is added is not less than 2 hours, and the final molar ratio of anhydride to amine is controlled at 0.995:1, The final viscosity is controlled at 120pa.s, the viscosity adjustment time is 4h, and the resin temperature is controlled within 30-60°C during the whole viscosity adjustment process;

[0031] (2) After the resin synthesized in step (1) is degassed and filtered, it i...

Embodiment 3

[0037] A preparation method for polyimide film for graphite sintering, comprising the steps of:

[0038] (1) Take 100.12kg ODA and dissolve it in 900kg NMP, take 109.06kg PMDA and add it to ODA dissolved in polar solvent for resin synthesis, add 1.2kg of calcium hydrogen phosphate particles with a particle size of 1000nm after the resin is viscous, hydrogen phosphate Calcium particles are uniformly dispersed during the resin synthesis process, the resin synthesis temperature is controlled to not exceed 65°C, the resin synthesis time is 6 hours, the dispersion time after adding the heat-conducting material is not less than 2 hours, and the final molar ratio of anhydride to amine is controlled at 0.995:1. The viscosity is controlled at 120pa.s, the viscosity adjustment time is 4h, and the resin temperature is controlled within 30-60°C during the whole viscosity adjustment process;

[0039] (2) After the resin synthesized in step (1) is degassed and filtered, it is evenly coated ...

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Abstract

The invention relates to the field of preparation of polyimide films, specifically to a preparation method for a polyimide film used for graphite sintering. With the preparation method for the polyimide film used for graphite sintering provided by the invention, aromatic diamine is dissolved in a polar solvent and then polymerized with aromatic dianhydride to prepare polyimide acid resin; a heat-conductive material is introduced in the synthesis process of resin; when the resin is guided to solidify and imidize, a molecular chain is in two-dimensional and uniform-tendency arrangement; thus, growth of a hexagonal two-dimensional carbon plane during high-temperature sintering is easily realized; problems like uneven wrinkles and low heat conductivity of a graphite film due to heat shrinkage and structural problems of the polyimide film are avoided; the problems of large heat shrinkage, a plurality of wrinkles and low heat conductivity of sintered graphite are solved; and the polyimide film obtained by using the preparation method provided by the invention has smooth and fine surface and achieves heat conductivity of 1500 W / MK or above after high-temperature sintering.

Description

technical field [0001] The invention relates to the field of polyimide film preparation, in particular to a preparation method of polyimide film for graphite sintering. Background technique [0002] As a high-strength, high-modulus and weather-resistant material, polyimide has been widely concerned and favored in advanced industries such as electronic devices and aerospace vehicles. The general preparation method of polyimide film is: polyamic acid solution is cast into film, after stretching, high temperature imidization. The film is yellow and transparent, with a relative density of 1.39-1.45. It has outstanding high temperature resistance, radiation resistance, chemical corrosion resistance and electrical insulation performance. It can be used for a long time in the air at 250-280 °C. The glass transition temperatures are 280°C (Upilex R), 385°C (Kapton) and above 500°C (Upilex S). The tensile strength is 200MPa at 20°C and greater than 100MPa at 200°C. It is especiall...

Claims

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Application Information

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IPC IPC(8): C08J5/18C08L79/08C08K3/38C08K7/00C08K3/34C08K3/32C08G73/10C01B32/205
CPCC08G73/1042C08G73/105C08G73/1071C08G73/1075C08J5/18C08J2379/08C08K3/32C08K3/34C08K3/38C08K7/00C08K2003/325C08K2003/385C01B32/205
Inventor 程翠华陈胜绪李开明张彩霞刘丹丹赵春晖马志远
Owner 富优特(山东)新材料科技有限公司
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