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curable epoxy resin composition

An epoxy resin, curable technology, used in electrical solid devices, semiconductor/solid state device parts, electrical components, etc., can solve problems such as luminosity reduction, achieve excellent quality and durability, inhibit luminosity reduction over time, The effect of luminosity is not easy

Active Publication Date: 2016-04-27
DAICEL CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the above-mentioned cured product is used as a high-output blue or white optical semiconductor sealing resin, it is colored by light and heat emitted from the optical semiconductor element, and the light that should be output is absorbed. The problem that the luminosity of the light output by the device decreases over time

Method used

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  • curable epoxy resin composition
  • curable epoxy resin composition
  • curable epoxy resin composition

Examples

Experimental program
Comparison scheme
Effect test

manufacture example 1

[0125] (The mixture of curing agent, curing accelerator and additive, hereinafter referred to as K agent)

[0126] 100 parts by weight of a curing agent (manufactured by Shinnippon Chemical Co., Ltd., Rikacid MH-700), a curing accelerator (manufactured by San-apro Co., Ltd.) ), 0.5 parts by weight of U-CAT18X), and 1 part by weight of an additive (manufactured by Wako Pure Chemical Industries, Ltd., ethylene glycol) were uniformly mixed and defoamed to obtain agent K.

manufacture example 2

[0128] (epoxy resin)

[0129] According to the compound prescription (unit: parts by weight) shown in Table 1 and Table 2, monoallyl diglycidyl isocyanurate (Shikoku Chemical Industry Co., Ltd., MA-DGIC), cycloaliphatic epoxy compound (manufactured by Daicel, CELLOXIDE2021P), and siloxane derivatives having two or more epoxy groups in the molecule (manufactured by Shin-Etsu Chemical Co., Ltd., X-40-2678; manufactured by Shin-Etsu Chemical Co., Ltd., X-40-2720; manufactured by Shin-Etsu Chemical Co., Ltd., X-40-2670) were mixed and stirred at 80°C for 1 hour to dissolve monoallyl diglycidyl isocyanurate to obtain an epoxy resin (mixture).

Embodiment 1～12、 comparative example 1～4

[0131] In Examples 1 to 12, using a self-revolving stirring device (manufactured by THINKY Co., Ltd., Awatori Rentaro AR-250), according to the formula shown in Table 1 (unit: parts by weight), the mixture obtained in Production Example 2 was prepared. Each component of the epoxy resin and the agent K obtained in Production Example 1 was uniformly mixed and defoamed to obtain a curable epoxy resin composition. In addition, as shown in Table 1, in Comparative Example 1, only an alicyclic epoxy compound (manufactured by Daicel Chemical Industry Co., Ltd., CELLOXIDE 2021P) was used as an epoxy resin, and in Comparative Examples 2 to 4, only molecular Siloxane derivatives having two or more epoxy groups (manufactured by Shin-Etsu Chemical Co., Ltd., X-40-2678; manufactured by Shin-Etsu Chemical Co., Ltd., X-40-2720; manufactured by Shin-Etsu Chemical Co., Ltd. , X-40-2670) as an epoxy resin, the same operation as above was performed to obtain a curable epoxy resin composition.

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Abstract

The purpose of the present invention is to provide a curable epoxy resin composition capable of yielding a cured product which has high transparency, heat resistance, light resistance and crack resistance. This curable epoxy resin composition is characterized by comprising (A) an alicyclic epoxy compound, (B) a monoallyl diglycidyl isocyanurate compound represented by formula (1), (C) a siloxane derivative which has two or more epoxy groups in the molecule, (D) a curing agent, and (E) a cure accelerator. In formula (1), R1 and R2 are each a hydrogen atom or C1-8 alkyl.

Description

technical field [0001] The present invention relates to a curable epoxy resin composition, a cured product obtained by curing the curable epoxy resin composition, a resin composition for encapsulating an optical semiconductor containing the curable epoxy resin composition, and a resin composition using the curable epoxy resin composition. An optical semiconductor device obtained by sealing an optical semiconductor element with an epoxy resin composition. Background technique [0002] In recent years, the output of optical semiconductor devices has been increasing, and high heat resistance and light resistance are required for resins used in optical semiconductor devices. For example, in encapsulating materials (encapsulating resins) for blue and white optical semiconductors, yellowing of the encapsulating resin due to light and heat emitted from the optical semiconductor element becomes a problem. Since the yellowed sealing resin absorbs light emitted from the optical semic...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/26C08G59/24H01L23/29H01L23/31H01L33/00
CPCH01L23/293C08G59/226C08G59/26C08G59/3281C08G59/38C08L63/00H01L33/56H01L2224/48091H01L2224/48247
Inventor 铃木弘世
Owner DAICEL CHEM IND LTD