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Curable resin composition and cured product

A technology of curable resin and composition, applied in the direction of semiconductor/solid-state device parts, electrical components, circuits, etc., can solve the problem of unsatisfactory crack resistance and other problems, achieve excellent transparency, excellent flexibility, high temperature and heat resistance Excellent effect of yellowing and softness

Inactive Publication Date: 2015-09-16
DAICEL CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the physical properties of these materials, such as crack resistance, still do not meet the needs

Method used

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  • Curable resin composition and cured product
  • Curable resin composition and cured product
  • Curable resin composition and cured product

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0140] Hereinafter, although an Example demonstrates this invention more concretely, this invention is not limited to these Examples. It should be noted, 1 H-NMR analysis was carried out by JEOL ECA500 (500 MHz).

Synthetic example 1

[0141] Synthesis Example 1 [Synthesis of Ladder Vinylphenylmethylsilsesquioxane]

[0142] Into a 300ml four-necked flask, add ladder-type terminal ethoxyphenylmethylsilsesquioxane (the weight-average molecular weight Mw is 2200, the content of ethoxy group per molecule is 1.5% by weight, phenyl / methylsilsesquioxane base (molar ratio) = 1 / 1) 10 g, 3.0 g of 10% by weight tetramethylammonium hydroxide, 200 g of methyl isobutyl ketone, and 5.5 g of dimethylethoxyvinylsilane. The reaction was terminated by heating at 45°C for 1 hour. After adding 100 g of ethyl acetate, water washing was performed five times with 500 g of water. After concentrating the washed upper layer with an evaporator, suction and pressure reduction were performed with a vacuum pump for 30 minutes. A liquid ladder-type vinylphenylmethylsilsesquioxane (corresponding to a vinyl-type ladder-type silsesquioxane compound) weighing 7.8 g was obtained. The weight average molecular weight Mw was 1700, and the conte...

Embodiment 1

[0146] Example 1 [Manufacture of curable resin composition 1 containing isocyanuric acid-containing ladder-type silsesquioxane and its cured product 1]

[0147] Weigh 6.00 g of ladder-type vinylphenylmethylsilsesquioxane obtained in Synthesis Example 1, 0.30 g of diallylmethyl isocyanuric acid (manufactured by Shikoku Chemicals) and 1,1,3,3 , 1.41 g of 5,5-hexamethyltrisiloxane (manufactured by Gelest), was put into a 6 ml coil, and stirred at room temperature for 2 hours to obtain a transparent and uniform solution with good compatibility. 3 μL of a platinum vinylmethylsiloxane complex (manufactured by Wako Pure Chemical Industries; 1.6% by weight of platinum) was added to the obtained liquid mixture, and stirred again to obtain a curable resin composition 1 .

[0148] The obtained curable resin composition 1 was coated on a glass plate, and heated in an oven at 60° C. for 1 hour and 150° C. for 5 hours to obtain a colorless and transparent cured product 1 . The physical pro...

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Abstract

The curable resin composition according to the present invention contains ladder silsesquioxane (A) and straight-chain polysiloxane (B) having a molecular weight of 100 to 9000, (A) and (B) being able to react with each other to form carbon-silica bonds by hydrosilylation, and a hydrosilylation catalyst (C). The curable resin composition may further contain an isocyanuric acid compound (D) that can form carbon-silica bonds by hydrosilylation by reacting with the ladder silsesquioxane (A) and / or straight-chain polysiloxane (B). Using the curable resin composition of the present invention, it is possible to obtain cured articles having high-temperature heat resistance, flexibility, transparency, resistance to heat-induced yellowing, resistance to light-induced yellowing, and the like.

Description

technical field [0001] The present invention relates to a curable resin composition, a sealing agent containing the composition, a cured product of the composition, an LED, and an optical semiconductor device. Background technique [0002] In a semiconductor device with high heat resistance and high withstand voltage, a material having heat resistance of 150° C. or higher is required as a material for covering a semiconductor element. In particular, as a material for coating optical materials such as LED elements, in addition to heat resistance, physical properties such as flexibility, transparency, heat yellowing resistance, and light yellowing resistance are required. When conventional epoxy resins and modified silicone resins are used as sealants, there is a problem that components are burnt and blackened when conducting an electrical test at Tj=180°C. In addition, dimethylpolysiloxane-based resins have heat resistance below 150°C, but they become brittle when heated to ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L83/07C08L83/05H01L33/56
CPCC08L83/04C08G77/20C08G77/12H01L33/56C08G77/04C08G77/045C08K5/34924C08K5/5435C08L83/00H01L23/29
Inventor 秃惠明井上庆三不别博文
Owner DAICEL CHEM IND LTD