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A kind of overlapping method of hollow silicon core and solid silicon core

A technology of hollow silicon cores and silicon cores, which is applied to fine working devices, stone processing equipment, manufacturing tools, etc., can solve problems such as increased fracture or collapse of silicon cores, inability to grow silicon cores, and large impact of cracks, etc., to achieve Effects of reducing processing steps, ensuring yield rate, and overcoming lodging phenomenon

Active Publication Date: 2016-03-02
LUOYANG JINNUO MECHANICAL ENG
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Problems solved by technology

[0007] At present, there are wire-cut square silicon cores on the market. Due to the wire-cutting process, the crystal is subjected to micro-shocks in diamond wire-cutting, so that there are many tiny cracks in the finished square silicon core that are difficult to detect with the naked eye. The instantaneous impact on the cracks is large, which greatly increases the amount of fractures or collapses during the growth of the silicon cores. In the light cases, the group of silicon cores cannot grow, and in severe cases, the furnace will be shut down. Then, large-diameter silicon cores are used for lap joints. The rapid growth of polycrystalline rods and the improvement of the strength of the silicon core itself have become a technical barrier that is difficult for those skilled in the art to overcome; however, how to increase the diameter of the silicon core is also a long-term demand for those skilled in the art

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  • A kind of overlapping method of hollow silicon core and solid silicon core
  • A kind of overlapping method of hollow silicon core and solid silicon core
  • A kind of overlapping method of hollow silicon core and solid silicon core

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Embodiment Construction

[0033] The present invention can be explained in more detail with reference to the following examples, but the present invention is not limited to these examples.

[0034] combined with Figure 1-8 The overlapping method of the hollow silicon core and the solid silicon core comprises a horizontal silicon core 1 and a vertical silicon core tube 3, and the two ends of the horizontal silicon core 1 are connected to two vertical silicon core tubes by clamping or plugging respectively. The upper ends of 3 are connected to form a "∏"-shaped structure; the lower parts of the two vertical silicon core tubes 3 are connected to the graphite seat or tungsten seat or molybdenum seat and the electrode of the reduction furnace to form a "∏"-shaped conductive circuit.

[0035] combined with figure 1Or the structure given in 2, the two ends of the horizontal silicon core 1 are respectively connected to the upper ends of the two vertical silicon core tubes 3 by plugging to form a "∏"-shaped s...

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Abstract

The invention discloses a lap joint method between a hollow silicon core and a solid silicon core, and belongs to lap joint technology of silicon cores. The hollow silicon core comprises a horizontal silicon core (1) and the solid silicon core comprises vertical silicone core pipes (3), wherein two ends of the horizontal silicon core pipe (1) are respectively connected with the upper ends of the two vertical silicon core pipe (5) in a clamping mode or an inserting mode to form an n-shaped structure. A patent family of the invention discloses a machining process of the hollow silicone core. The invention discloses a lap joint method between the hollow silicone core and the solid silicon core, wherein the method directs at later use of the hollow silicon core. The horizontal silicon core is a solid silicon core and the vertical silicone core pipes are hollow silicon cores. The hollow silicon cores and the solid silicon core are combined to form an n-shaped conductive circuit, and therefore the purpose that lodging occurs as little as possible is achieved. The vertical silicon core pipes and the solid silicon core have the advantages that the weights are basically equal, but the diameter of the hollow silicon core is far greater than that of the solid silicon core.

Description

【Technical field】 [0001] The invention belongs to the lap joint technology of silicon cores, in particular to a lap joint method of hollow silicon cores and solid silicon cores or other crystal materials. 【Background technique】 [0002] It is known that the silicon core bonding technology is a very important technology in the process of producing polysilicon by the Siemens method, and it is mainly used in a link of polysilicon production, that is, the reduction reaction process. The principle of the reduction reaction process is: the reduction reaction is carried out in a closed reduction furnace, and several closed loops are formed by lapping silicon cores in the reduction furnace before loading the furnace, which is the "bridge" in the jargon. "; each closed circuit is formed by two vertical silicon cores and a horizontal silicon core to form a "∏"-shaped structure; the two vertical silicon cores of each closed circuit are respectively connected to two electrodes on the bo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D5/00
Inventor 刘朝轩王晨光
Owner LUOYANG JINNUO MECHANICAL ENG
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