Device and method for cleaning and drying wafer cassettes

A wafer box and drying technology, which is applied in the direction of liquid cleaning method, drying gas arrangement, chemical instruments and methods, etc., can solve the problems that affect the normal use of the wafer box, poor drying effect, and unstable drying effect. Achieve the effect of improving stability and safety, improving drying effect and avoiding reaction

Active Publication Date: 2013-06-26
SEMICON MFG INT (SHANGHAI) CORP
View PDF10 Cites 27 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, after using it, it is found that the drying effect of the wafer box close to the heating source is better, and the drying effect of

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Device and method for cleaning and drying wafer cassettes
  • Device and method for cleaning and drying wafer cassettes
  • Device and method for cleaning and drying wafer cassettes

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] see figure 1 , this device for cleaning and drying wafer cassettes includes a cleaning chamber 100, a support 101 for supporting several wafer cassettes 200, a cleaning liquid nozzle 102 connected to an external cleaning liquid source, a liquid discharge pipeline 103 and an exhaust gas The pipeline 104, the drain pipeline 103 and the exhaust pipeline 104 are respectively connected to the bottom of the cleaning chamber 100, the bracket 101 and the cleaning liquid nozzle 102 are arranged in the cleaning chamber 100, so The above-mentioned device for cleaning and drying the wafer cassette also includes a drying gas nozzle 105 externally connected to a drying gas source, and the drying gas nozzle 105 is arranged in the cleaning chamber 100 . In addition to the cleaning liquid nozzle 102 connected to the cleaning liquid source in the cleaning chamber 100, the present invention also sets the drying gas nozzle 105 connected to the drying gas source. The use of dry gas can not ...

Embodiment 2

[0047] see image 3 , this method for cleaning and drying the wafer box, the wafer box is placed in the cleaning chamber, the device for cleaning and drying the wafer box as described in Embodiment 1 can be used, but it is not limited to this structure , the method includes the following steps:

[0048] Proceed to step S1, turn on the cleaning solution for a period of time, and spray the cleaning solution into the cleaning chamber to fully clean the wafer cassette. The time can be set according to actual conditions. In the step S1 of the present embodiment, the cleaning liquid adopts ultrapure water (UPW), and the time of opening the cleaning liquid is 10 minutes, and the flow rate of the cleaning liquid is 60 liters / minute (L / Min); It is in the closed state; the support and the wafer cassette on it are in the rotating state.

[0049] Carry out step S2, after closing the cleaning liquid, heat the cleaning chamber for a period of time to dry the cleaning chamber. This step S2...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a device for cleaning and drying wafer cassettes. The device for cleaning and drying the wafer cassettes comprises a cleaning cavity, a support frame used for supporting a plurality of the wafer cassettes, a cleaning liquid spray pipe externally connected with a cleaning liquid source, a liquid discharging pipeline and an air exhausting pipeline, wherein the liquid discharging pipeline and the air exhausting pipeline are respectively connected with the bottom of the cleaning cavity, and the support frame and the cleaning liquid spray pipe are arranged in the cleaning cavity. The device for cleaning and drying the wafer cassettes further comprises a dry air spray pipe externally connected with a dry air source, and the dry air spray pipe is arranged in the cleaning cavity. The invention further discloses a method for cleaning and drying the wafer cassettes. The cleaning liquid spray pipe externally connected with the cleaning liquid source is arranged in the cleaning cavity, the dry air spray pipe externally connected with the dry air source is further provided, dry air can not only drive away ultrapure water vapor in the cleaning cavity, but also suck all condensed water condensed in the wafer cassettes, and comprehensive and sufficient drying of the wafer cassettes is achieved.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a device for cleaning and drying a wafer box. Background technique [0002] Currently, wafer cassettes are often used to transfer wafers between various processes in semiconductor production. The existing wafer box includes a box body with an opening on one side and a door cover. The door cover matches the opening of the box body to close the box body. The inner wall of the box body is provided with a Several grooves. [0003] After a certain amount of wafers are transported by the cassette, a large amount of particulate matter tends to accumulate during the contact process between the wafer and the cassette due to repeated placement and removal of wafers. Therefore, the wafer cassette needs to be cleaned regularly. At present, the commonly used cleaning method is: first open the wafer cassette, then put several wafer cassettes into the cleaning chamber of a large cl...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B08B3/02F26B21/00
Inventor 吴良辉
Owner SEMICON MFG INT (SHANGHAI) CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap