Preparation method of conductive sponge

Abstract

The invention discloses a preparation method of a conductive sponge. The preparation method has the beneficial effects that the sponge is compressed and stirred in conducting solution and glue solution respectively by adopting different compression and stirring methods in the preparation process of the conductive sponge, so that the prepared conductive sponge better adsorbs conductive particles and the glue better adheres to the conductive particles and the sponge, thus ensuring smaller surface resistance of the conductive sponge, more uniform distribution of volume resistance and smaller change of the hardness of the treated sponge.

Description

technical field [0001] The invention relates to the technical field of sponge conduction, in particular to a preparation method of a conductive sponge. Background technique [0002] The conductive sponge is produced by the polymer composite material foaming technology, and the foaming pore size is uniform, soft, elastic, and not desquamated. The uniform distribution of conductive sponge can protect the pins of the device, and at the same time it has corrosion resistance, which is an ideal dielectric material for long-term storage of devices. At the same time, the conductive sponge has the characteristics of long effective period of conductivity, not affected by temperature and humidity, and the surface resistance value can be customized according to actual use. [0003] The current method for making conductive sponges is generally to soak the sponges in a conductive latex solution for a certain period of time, and then spin dry them. The above-mentioned conductive latex so...

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Problems solved by technology

[0005] Based on this, it is necessary to address the problem that soaking the sponge in the conductive latex solution will easily cause the uneven distribution of the volume resistance of the conductive sponge, resulting in a large resistance of the conductive sponge, and provide a method for treating the sponge with a small resistance of the prepared conductive sponge.

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