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Bi-component epoxy adhesive and preparation method thereof

An epoxy adhesive, two-component technology, used in adhesives, epoxy resin adhesives, carboxyl rubber adhesives, etc. The effect of good connection, good adhesion and simple process

Inactive Publication Date: 2013-06-26
GUANGDONG XINZHAN NEW CHEM MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In short, an adhesive is a substance that can bind adherends together through bonding; traditional adhesives have poor adhesion due to unreasonable formula ratios and cannot meet the needs of use.

Method used

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  • Bi-component epoxy adhesive and preparation method thereof
  • Bi-component epoxy adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Two-component epoxy adhesive of the present invention comprises A component and B component, and described A component is made up of following components by weight:

[0037] Modified bisphenol A epoxy resin 30

[0038] Fluorenyl epoxy resin 20

[0039] Hyne Epoxy 15

[0040] The B component consists of the following components in parts by weight:

[0041] Maleic anhydride and endomethylenetetrahydrophthalic anhydride in a 4:3 mixture 20.

[0042] Preparation:

[0043] A, prepare modified bisphenol A epoxy resin

[0044] Under the condition of nitrogen protection, heat 100 parts by weight of bisphenol A type epoxy resin and 1 part by weight of liquid carboxyl-terminated nitrile rubber to 85 °C according to the above ratio to mix the two evenly, add 15 parts by weight of dicyandiamide, stir, Simultaneously vacuumize and react for 0.5 hours; keep warm for 4 hours at 130°C;

[0045] B. Preparation of fluorenyl epoxy resin

[0046] Add 10 parts by weight of bisphenol ...

Embodiment 2

[0050] Two-component epoxy adhesive of the present invention comprises A component and B component, and described A component is made up of following components by weight:

[0051] Modified bisphenol A epoxy resin 30

[0052] Fluorenyl epoxy resin 70

[0053] Hein Epoxy 50

[0054] The B component consists of the following components in parts by weight:

[0055] A 4:3 mixture of maleic anhydride and endomethylene tetrahydrophthalic anhydride 150.

[0056] Preparation:

[0057] A, prepare modified bisphenol A epoxy resin

[0058] Under the condition of nitrogen protection, heat 100 parts by weight of bisphenol A epoxy resin and 8 parts by weight of liquid-terminated carboxylated nitrile rubber to 120 °C according to the above ratio to mix the two evenly, add 30 parts by weight of dicyandiamide, stir, Simultaneously vacuumize and react for 1.5 hours; keep warm for 4 hours at 160°C;

[0059] B. Preparation of fluorenyl epoxy resin

[0060] Add 20 parts by weight of bisphen...

Embodiment 3

[0064] Two-component epoxy adhesive of the present invention comprises A component and B component, and described A component is made up of following components by weight:

[0065] Modified bisphenol A epoxy resin 60

[0066] Fluorenyl epoxy resin 20

[0067] Hyne Epoxy 15

[0068] The B component consists of the following components in parts by weight:

[0069] A 4:3 mixture of maleic anhydride and endomethylenetetrahydrophthalic anhydride 90.

[0070] Preparation:

[0071] A, prepare modified bisphenol A epoxy resin

[0072]Under the condition of nitrogen protection, heat 100 parts by weight of bisphenol A type epoxy resin and 3 parts by weight of liquid carboxylated nitrile rubber to 90°C according to the above ratio to mix the two evenly, add 18 parts by weight of dicyandiamide, stir, Simultaneously vacuumize and react for 1 hour; keep warm for 4 hours at 140°C;

[0073] B. Preparation of fluorenyl epoxy resin

[0074] Add 15 parts by weight of bisphenol fluorene an...

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Abstract

The invention discloses a bi-component epoxy adhesive and a preparation method thereof. The adhesive comprises a component A and a component B, wherein the component A is prepared from the following ingredients in parts by weight: 30-80 parts of modified bisphenol A epoxy resin, 20-70 parts of fluorene epoxy resin and 15-50 parts of hydantoin epoxy resin; the component B is prepared from 20-150 parts of anhydride curing agent. The preparation method comprises the following steps of weighing each component according to the ratio, putting the modified bisphenol A epoxy resin, the fluorene epoxy resin and the hydantoin epoxy resin into a reaction kettle and agitating evenly, so as to obtain the component A; heating the component A to 30-60 DEG C, and adding the component B which is the anhydride curing agent; and finally evenly agitating. The bi-component epoxy adhesive is good in adhesion and simple in process and has good adhesion when applied to the materials such as metal, glass, plastic ceramic and the like.

Description

technical field [0001] The invention relates to a two-component epoxy adhesive; the invention also relates to a method for preparing the modified epoxy resin adhesive. Background technique [0002] Adhesive refers to a kind of natural or synthetic, organic or inorganic substances that can connect two or more parts or materials together through the adhesion and cohesion of the interface, collectively referred to as glue. Adhesives, also known as adhesives, are customarily referred to as glue. In short, an adhesive is a substance that can bind adherends together through bonding; traditional adhesives have poor adhesion due to unreasonable formula ratios and cannot meet the needs of use. Contents of the invention [0003] The object of the present invention is to overcome the deficiencies in the prior art, and provide a two-component epoxy adhesive with reasonable components and ratio and good bonding performance. [0004] Another object of the present invention is to provi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J163/02C09J113/00C08G59/42
Inventor 黄活阳
Owner GUANGDONG XINZHAN NEW CHEM MATERIAL
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