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High-density full color light-emitting diode (LED) display dot matrix module

A high-density, LED chip technology, applied to static indicators, instruments, electrical components, etc., to increase display density, improve thermal energy management, and reduce power waste

Inactive Publication Date: 2015-01-21
四川英创力电子科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If it is necessary to continue to reduce the pixel pitch of the LED display module, the design method of using packaged lamp beads for assembly has encountered a technical bottleneck

Method used

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  • High-density full color light-emitting diode (LED) display dot matrix module
  • High-density full color light-emitting diode (LED) display dot matrix module
  • High-density full color light-emitting diode (LED) display dot matrix module

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Embodiment Construction

[0018] Below in conjunction with accompanying drawing and specific embodiment the present invention will be further described:

[0019] refer to Figure 1 to Figure 4 As shown, the present invention discloses a high-density full-color LED display dot matrix module, which includes an LED substrate 1 (printed circuit board), and LEDs of three colors of red, blue and green light distributed on the LED substrate 1 in a matrix. A chip (not shown in the figure) and a driving circuit (not shown in the figure), the LED substrate 1 includes at least three copper foil layers from top to bottom, and a filling interstitium 6 is arranged between two adjacent copper foil layers, The uppermost copper foil layer 2 and the filling interstitium 6 are provided with a number of LED chip accommodating grooves 11 arranged in a matrix, that is, a plurality of LED chip accommodating grooves 101 are opened on the LED substrate 1 for directly packaging the LED chips in the LED On the substrate 1, each...

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PUM

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Abstract

The invention discloses a high-density full color light-emitting diode (LED) display dot matrix module which comprises an LED substrate, a red LED chip, a blue LED chip, a green LED chip and a drive circuit, wherein the red LED chip, the blue LED chip and the green LED chip are distributed on the LED substrate in a matrix. The improved characteristics of the high-density full color LED display dot matrix is that the LED substrate comprises at least three copper foil layers, filling substances are filled between two adjacent copper foil layers, a plurality of LED chip holding grooves which are arranged in a matrix are disposed on the uppermost copper foil layer and the filling substance, each LED chip holding groove is provided with an LED chip bonding pad, a positive powered bonding pad and a negative powered bonding pad, the red LED chip, the blue LED chip and the green LED chip are welded on each corresponding LED chip bonding pad, a positive lead foot and a negative lead foot of each LED chip are electrically connected with each corresponding positive powered bonding pad and negative powered bonding pad, and the positive powered bonding pad and negative powered bonding pad are connected with the drive circuit. The high-density full color LED display dot matrix has the advantages that LED chips are packed in the LED substrate (FR4 printed circuit board) which comprises four copper foil layers, spaces between pixels are reduced effectively, and display density of the LED display module is increased.

Description

【Technical field】 [0001] The invention relates to the technical field of LED display, in particular to a high-density full-color LED display dot matrix module. 【Background technique】 [0002] As the LED display as a new generation of display carrier is increasingly used in people's work and life, its application is becoming more and more extensive. The strong outdoor adaptability of the LED display makes it the king of outdoor dynamic display devices. However, in terms of indoor large-screen applications, this is not the case. [0003] For a long time, the indoor large-screen market, such as cinemas, conference rooms, control rooms and stage backgrounds, has been dominated by projectors, flat-panel LCDs and PDPs. There are two reasons. First, the pixels of the LED display cannot be made small enough. Second, the price of the LED chip itself remains high. Generally, display manufacturers only focus on the application of LED lamp beads, and do not involve the packaging techn...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G09F9/33G09G3/32H01L33/62
Inventor 任兴业
Owner 四川英创力电子科技股份有限公司