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A kind of oled device encapsulation thin film, preparation method and oled device, encapsulation method

A technology of device packaging and thin film, which is applied in semiconductor/solid device manufacturing, electric solid device, semiconductor device, etc., can solve the problems that cannot fully meet the life requirements of OLED devices, and achieve the effect of improving life and reducing water vapor and oxygen

Active Publication Date: 2016-06-01
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it has been proved by practice that the current water vapor transmission rate (WaterVaporTransmissionRate, WVTR) is about 10 due to the limitation of the polymer material used to form the transparent film. -3 g / m 2 / day, cannot fully meet the life requirements of OLED devices

Method used

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  • A kind of oled device encapsulation thin film, preparation method and oled device, encapsulation method
  • A kind of oled device encapsulation thin film, preparation method and oled device, encapsulation method
  • A kind of oled device encapsulation thin film, preparation method and oled device, encapsulation method

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Experimental program
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Effect test

Embodiment 1

[0035] A thin film for encapsulating OLED devices includes a transparent film layer and a barrier film layer, and the barrier film layer surrounds the periphery of the transparent film layer.

[0036] like image 3 As shown, the film for OLED device encapsulation includes a first protective layer 43 and a second protective layer 44 oppositely arranged, and a transparent film layer 41 and a barrier film layer are also arranged between the first protective layer 43 and the second protective layer 44 42 , the barrier film layer 42 surrounds the periphery of the transparent film layer 41 .

[0037] Wherein, the area of ​​the transparent film layer is greater than or equal to the area of ​​the top surface or the bottom surface of the OLED device to be packaged, and the inner wall of the barrier film layer 42 is connected with the outer wall of the transparent film layer 41, such as Figure 4 shown.

[0038] In addition, the thickness of the transparent film layer is greater than ...

Embodiment 2

[0061] The difference between this embodiment and Embodiment 1 is that in this embodiment, in the barrier film layer of the OLED device packaging film, the ratio of the alkaline earth metal oxide to the polymer is gradually changed, and the barrier film layer The ratio of alkaline earth metal oxides far away from the transparent film layer is greater than the ratio of alkaline earth metal oxides near the transparent film layer.

[0062] In this embodiment, in each vertical sub-layer of the barrier film layer, the ratio of the alkaline earth metal oxide in the high molecular polymer ranges from 5% to 20%. like Figure 5 As shown, the barrier film layer includes two vertical sub-layers, wherein the ratio of the alkaline earth metal oxide in the vertical sub-layer of the barrier film layer away from the transparent film layer is 15%, and in the vertical sub-layer near the transparent film layer The proportion of the alkaline earth metal oxide in the longitudinal sublayer of the ...

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Abstract

The invention belongs to the field of display technology, and in particular relates to a film for encapsulating OLED devices, a preparation method for the film for encapsulating OLED devices, an OLED device and a method for encapsulating OLED devices. A thin film for encapsulating OLED devices includes a transparent film layer and a barrier film layer, and the barrier film layer surrounds the periphery of the transparent film layer. The thin film for encapsulating the OLED device can effectively reduce water vapor and oxygen permeating into the OLED device from the outside, and improve the service life of the OLED device.

Description

technical field [0001] The invention belongs to the field of display technology, and in particular relates to a thin film for encapsulating an OLED device, a preparation method for the film for encapsulating an OLED device, an OLED device and a method for encapsulating the OLED device. Background technique [0002] Organic light-emitting diode (OLED) devices have bright prospects in the display field due to their many advantages. However, the active metal used to form the metal cathode in the OLED device is very sensitive to water vapor and oxygen in the air, and it is very easy to react with the infiltrated water vapor, affecting the injection of charges. In addition, the infiltrated water vapor and oxygen will also chemically react with organic materials, and these reactions are the main factors that cause the performance degradation of OLED devices and shorten the life of OLED devices. Therefore, encapsulation technology is very important for OLED devices. [0003] At p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/52H01L51/56
CPCH10K50/841H10K50/844
Inventor 洪瑞李周炫金东焕
Owner BOE TECH GRP CO LTD