Non-glue single face copper clad laminate with bonding function and manufacturing method thereof
A copper-clad substrate, single-sided technology, applied in the field of adhesive-free single-sided copper-clad substrate and its manufacturing, can solve the problems of poor appearance, high price of pure adhesive film, low yield, etc. Operation, dimensional stability, and the effect of improving production yield
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[0015] Embodiment: The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and characteristics of the present invention can be more easily understood by those skilled in the art, thereby making a clearer definition of the protection scope of the present invention .
[0016] An adhesive-free single-sided copper-clad substrate with pasting function, comprising an insulating base material 2 and a copper foil layer 1, the insulating base material 2 is formed on the lower surface of the copper foil layer 1, and the lower surface of the insulating base material 2 is An insulating adhesive layer 3 is formed on the surface, and a release layer 4 is attached to the lower surface of the insulating adhesive layer 3 .
[0017] Wherein, the insulating adhesive layer 3 is in a semi-fluid and semi-cured state (B-stage).
[0018] Wherein, the insulating substrate 2 is one of polyimide (PI) film...
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