A novel high-efficiency cooling case and heat dissipation method thereof

Abstract

The invention relates to a novel high-efficiency cooling machine case and a radiating method thereof, in particular to a machine case of airborne electronic equipment and a radiating method thereof, and belongs to the technical field of the cooling of electronic devices. The high-efficiency cooling machine case comprises cold plates (1), line replaceable module (LRM) modules (2) to be cooled and locking mechanisms (3) which are arranged in the machine case, wherein the LRM modules (2) to be cooled are parallel to the cold plates (1); and two ends of the LRM modules (2) to be cooled are fixed by the locking mechanisms (3) which are fixedly connected on the cold plates (1). By the high-efficiency cooling machine case, high contact thermal resistance and conductive thermal resistance between the machine case and the LRM modules to be cooled can be reduced, the cooling effect can be improved obviously, the work temperature of the LRM modules to be cooled can be reduced, the reliability of a system can be improved, and the high-efficiency cooling machine case is wide in application range.

Description

technical field [0001] The invention relates to a novel high-efficiency cooling case and a heat dissipation method thereof, in particular to an airborne electronic equipment case and a heat dissipation method thereof, and belongs to the technical field of cooling of electronic devices. Background technique [0002] Modern airborne electronic equipment (abbreviated as ATR) generally has a modular design, and modules with a certain function are often designed as field-replaceable modules (LRM modules), and several such modules are often installed in a chassis. A standard chassis is generally in the form of a cuboid. With the development of technology, the heat consumption and heat flux density of the modules in the ATR chassis are increasing, and the cooling method is also developing from natural cooling to forced air cooling and liquid cooling. [0003] Air-cooled chassis structures and cooling methods have been disclosed at present, such as the chassis structures and coolin...

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Problems solved by technology

[0006] The purpose of the present invention is to provide a new type of high-efficiency cooling chassis and its heat dissipation method to reduce the high heat flux density of the existing cooling chassis and the deficiencies of the field replaceable module cooling and processing. The field can replace the contact thermal resistance and conduction thermal resistance between the module and the cold plate of the chassis, change the flow channel connection structure between the cold plates of the multi-layer chassis and the connection structure between the cold plate and the side panel of the chassis and the fluid joint, and improve the cooling performance of the chassis. Cooling effect, while reducing the complexity of chassis processing and reducing the processing cost of the chassis

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