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Hybrid adhesive and the use thereof in engineered wood boards
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An adhesive, hybrid technology, applied in the field of manufacturing wood panels, can solve the problems of incompatibility, poor process performance, etc., to achieve the effect of improved ecology and compatibility, improved requirements, excellent workability and adhesion
Active Publication Date: 2014-09-17
KRONOTEC
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Problems solved by technology
[0010] It is known that using polycondensation and polyaddition adhesives together creates incompatibilities between the two adhesive systems which lead to poorer process properties
Method used
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example 1
[0083] Example 1: Manufacturing of the first hybrid adhesive
[0084] Provide a urethane matrix in which there are also OH groups or unbound cyano groups. SiO 2 The granules are stirred into the urethane matrix in the desired amount. Subsequently, isocyanopropyltriethoxysilane and possible initiator dibutylisotin dilaurate are added for the case where the initiator is not yet contained in the polyurethane. The mixture is heated to 50°C and maintained at this temperature for approximately 30 minutes. After cooling to room temperature, glycidoxypropyltriethoxysilane and an acid such as phosphoric acid as a catalyst are added, and stirring is continued for 60 minutes. Subsequently, the polyurethane-silane-SiO 2 The mixture is mixed with melamine resin.
example 2
[0085] Example 2: Manufacturing of the second hybrid adhesive
[0086] An ethanol / water mixture is provided, and a mixture consisting of glycidoxypropyltriethoxysilane and ethyl orthosilicate is added. Subsequently, the water-containing silica sol solvent, that is to say nano-scale SiO 2 The particles are added to water, as well as acid as a catalyst, such as acetic acid or p-toluenesulfonic acid. After 5 minutes of stirring time, the melamine resin mixture was added, and after an additional 20 minutes of stirring time, the polyurethane adhesive was added.
example 3
[0087] Example 3: Wood chip board manufacturing
[0088] The shape and size of the chips have a decisive influence on the quality of the chipboard. The middle layer is composed of larger wood chips that give the board stability, and the cover layer (outer layer) should be composed of smaller wood chips in order to obtain a flat and regular surface. Depending on the raw material, it can have a better or worse effect on the shape and size of the wood chips. Therefore, in order to manufacture products with good quality, modern wood chip board technology always uses a certain share of fine-grained wood chips for a flat and uniform covering layer, and a major share for the stability under the covering board. , Layered structure, cut new wood and old wood (new logs or sawn wood waste such as bark, split wood, old wood) with sawdust of different lengths.
[0089] The wood farm is the entrance to the raw materials. Here, different wood species (quality of wood, storage capacity, deter...
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Abstract
The invention relates to a hybrid adhesive, in particular for the manufacture of wood such as particle boards, fibreboards, plywood or laminated plywood, comprising at least one polycondensation adhesive, at least one polyaddition adhesive and at least one Particles of nanoparticles, in particular smaller than 500 nm, wherein at least one particle is treated with at least one compound RaSiX(4-a)(I) in the form of the general formula (I) or a compound in the form of the general formula (II) ObXc(OH)dReSiO(4-b-c-d-e) / 2(II) modification, where -X is H, OH or selected from halogen, alkoxy, carboxyl, amino, mono- or di-alkylamino, aryloxy, Acyloxy, the hydrolyzable residue of alkylcarbonyl, -R is selected from substituted and unsubstituted alkyl, substituted and unsubstituted aryl, substituted and Non-hydrolyzable organic residues R of unsubstituted alkenyl, substituted and unsubstituted alkynyl, substituted and unsubstituted cycloalkyl, and wherein R has at least one functional group Q selected from From epoxy, hydroxyl, ether, amino, monoalkylamino, dialkylamino, substituted and unsubstituted anilino, acyl, carboxyl, alkynyl, acrylic, acryloyloxy, methacrylic, methacryloyl Oxygen, mercapto, cyano, alkoxy, isocyanate, aldehyde, alkylcarbonyl, anhydride and / or phosphoric acid groups, -R and X can be the same or different from each other, and -a=1,2, 3, especially 1, -b, c, d=0 or 1, and -e=1, 2, 3. The invention likewise relates to the use of an adhesive in wood panels and a method for their manufacture.
Description
Technical field [0001] The present invention relates to an adhesive according to the preamble of claim 1, the use of the adhesive according to claim 10, the method for manufacturing the adhesive according to claims 11 and 12, according to claims The wood board according to claim 13 and the method for manufacturing wood board according to claim 14. Background technique [0002] In the industrial production of many products and other wood manufacturing, adhesives are an important ingredient. Adhesives can be classified according to different standards based on the chemical basis of the adhesive or its curing mechanism. Based on the manufacturing method of the adhesive, a total of three upper classes of adhesives are defined: polymeric adhesives, polyaddition adhesives and polycondensation adhesives. It is also possible that adhesives are further classified according to their physical and / or chemical properties, for example into hot-melt adhesives or solvent-based adhesives. [000...
Claims
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Application Information
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