Method for manufacturing oversize printed circuit board (PCB) back plate inner layer

Abstract

The invention discloses a method for manufacturing an oversize printed circuit board back plate inner layer. Firstly, a PIN tack hole is drilled on an edge plate position of an inner layer cross-band veneer; secondly, a PIN tack film photographic plate is manufactured; thirdly, a PIN tack column is arranged in a corresponding position of the film photographic plate and the PIN tack hole; fourthly, the PIN tack column of the film photographic plate is correspondingly sleeved in the PIN tack hole of the inner layer cross-band veneer; fifthly, single-face exposure is conducted on the inner layer cross-band veneer; and finally, all steps are conducted on the other face of the inner layer cross-band veneer, and single-face exposure is conducted on the other face of the inner layer cross-band veneer. Compared with traditional book clamping mode exposure, according to the method, the PIN tack hole in the inner layer cross-band veneer and the PIN tack column of a film photographic plate are mutually matched so as to realize accurate counterpoints, avoid the problem of counterpoint deviation between two faces of the same cross-band veneer, and solve the problem of scrap of the inner cross-band veneers. The scrap of the inner cross-band veneer is caused by a short circuit due to A / B deviation when exposure treatment is conducted on a back plate of size larger than 660mm*810mm.

Description

Technical field: [0001] The invention belongs to the technical field of printed circuit board manufacturing, and specifically relates to a method for manufacturing the inner layer of a super-large PCB backboard, mainly for backboards with a size larger than 660mm*810mm. Background technique: [0002] With the high integration of electronic components on the circuit board and the increase in the number of I / O, the advancement of electronic assembly technology, the high-frequency and high-speed digital development of signal transmission, and the upgrading and replacement needs of the rapid development of electronic equipment, PCB has gradually become The direction of bearing function sub-boards, signal transmission and power transmission is developing, while its signal processing function is gradually weakening. This type of PCB is the backplane. Backplane (Backplane or Back panel) refers to a type of printed circuit board with lines and many rows of jacks, mainly used to carr...

AI Technical Summary

Problems solved by technology

[0005] For this reason, the object of the present invention is to provide a method for making the inner layer of a super-large PCB backplane, which is mainly used to solve the problem of A / B deviation easily occurring when the current backplane with a size larger than 660mm*810mm is subjected to exposure processing, resulting in The problem of short-circuiting and scrapping the inner layer of the board

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