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liquid resin composition

A technology of liquid resin and liquid epoxy resin, which is applied in the direction of semiconductor/solid device parts, electrical components, circuits, etc., can solve problems such as viscosity increase, and achieve excellent storage properties and excellent migration resistance.

Active Publication Date: 2015-11-25
NAMICS CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, it has such a problem: when benzotriazoles, etc. are dispersed in the epoxy resin, the viscosity will increase due to the hardening reaction during storage, and it will no longer be used as an underfill.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～18、 comparative example 1、2

[0083] Proportion shown in table 1 and table 2 has made liquid resin composition (hereinafter referred to as " resin composition ". Made resin composition is liquid state.

[0084] [Viscosity evaluation]

[0085] The viscosity (initial viscosity, unit: mPa·s) of the resin composition just produced was measured with the Toki Sangyo Co., Ltd. E-type viscometer (type: TVE-22H). Table 1 and Table 2 show the measurement results of initial viscosity. In addition, the viscosity of the resin composition after storage at 25° C. and a relative humidity of 50% for 24 hours or 48 hours was measured, and (viscosity after 24 or 48 hours) / (initial viscosity) was the viscosity increase rate (unit: %). Table 1 and Table 2 give the results.

[0086] [Water absorption evaluation]

[0087] Let the initial weight of the sample after hardening the resin composition at 150°C for 60 minutes be W 0 (g), and the weight of the test piece obtained by cooling to room temperature after being placed in ...

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Abstract

[Problem] The present invention addresses the problems of preventing migration of a liquid resin composition after curing and of suppressing an increase in the viscosity of the liquid resin composition during storage. Therefore, the purpose of the present invention is to provide a highly reliable liquid resin composition having excellent storage properties and excellent migration resistance after curing. [Solution] A liquid resin composition characterized by containing (A) a liquid epoxy resin, (B) a curing agent and (C) a xanthine having a specific structure, wherein component (C) is preferably at least one compound selected from a group comprising caffeine, theophylline, theobromine and paraxanthine.

Description

technical field [0001] The present invention relates to a liquid resin composition, and particularly relates to a liquid resin composition suitable for encapsulation of a flip chip type (flipchip) semiconductor element. Background technique [0002] Flip chip bonding (flip chip bonding) is used in COF (Chip On Film) packaging, which is a semiconductor element packaging method that is compatible with higher density and higher output of wiring of semiconductor devices such as liquid crystal driver ICs. Generally, in flip-chip bonding, a semiconductor element is bonded to a substrate with bumps, and a gap between the semiconductor element and the substrate is encapsulated with a liquid semiconductor encapsulant called an underfill material. [0003] In recent years, in order to meet the demands for higher density and higher output of liquid crystal driver ICs, fine pitches of wiring patterns for mounting liquid crystal driver ICs have been developed. Migration between wirings ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08K5/3462H01L23/29H01L23/31
CPCH01L23/293C08K5/3462C08K5/3472H01L2924/0002
Inventor 增子努柳沼宗宪明道大树本间洋希
Owner NAMICS CORPORATION