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Systems and methods for rapid pulsed gas delivery

A delivery system, gas technology, applied in control/regulation system, transportation and packaging, gaseous chemical plating, etc.

Active Publication Date: 2016-03-02
MKS INSTR INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Obviously, a lot of gas is wasted, thus increasing the cost of the process
The second method also has the disadvantage of poor repeatability and delivery accuracy

Method used

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  • Systems and methods for rapid pulsed gas delivery
  • Systems and methods for rapid pulsed gas delivery
  • Systems and methods for rapid pulsed gas delivery

Examples

Experimental program
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Embodiment Construction

[0021] Exemplary embodiments are now discussed. Other embodiments in addition to or instead of those described above may also be used. Obvious or unnecessary details may be omitted to save space or for more efficient illustration. Conversely, some embodiments may be practiced without using all of the disclosed details.

[0022] figure 1 A block diagram of one embodiment of a system configured to provide high velocity pulsed gas delivery is shown. The system 10 and the methods performed by using the system are particularly intended to deliver contamination-free, precisely metered quantities of process gases to semiconductor tools, such as semiconductor processing chambers or plasma etchers. The gas delivery system 10 reliably measures the amount (mass) of material flowing into a semiconductor tool and provides for precise delivery of gas mass in pulses of relatively short duration in a reliable and repeatable manner. In addition, the system employs a more simplified operat...

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Abstract

The present invention discloses systems and methods for delivering a desired mass of gas pulses to a tool. A system for pulse-delivering a desired mass of gas to a tool comprising: a gas delivery chamber; a first valve arranged to control the flow of gas flowing into the gas delivery chamber; a second valve arranged to control the flow of gas exiting the gas delivery chamber; The gas flow rate of the gas delivery chamber, so that the gas can leave the gas delivery chamber in pulses, the selected mass of each pulse is determined according to the initial pressure of the gas in the gas delivery chamber and the duration of each pulse; and the pressure control device, the configuration of which and arranged to control the flow rate of gas flowing into the gas delivery chamber so that the gas delivery chamber is pre-charged with gas prior to delivering the gas pulse to achieve an initial pressure set point such that the gas delivery chamber is controlled before the gas pulse is delivered. The difference in gas starting pressure and the duration of each pulse improves the repeatability of mass delivery.

Description

[0001] related application [0002] This application claims the benefit of US Patent Application Serial No. 12 / 893,554, filed September 29, 2010, the entire teachings of which applications are incorporated herein by reference. technical field [0003] The present invention relates generally to gas delivery devices, and more particularly to methods and systems for rapid pulsed gas delivery. The term "gas" as used herein includes the term "vapor" if the two terms are considered to be different. Background technique [0004] The fabrication or processing of semiconductor devices often requires the delivery of as many as a dozen gases to processing tools, such as vacuum processing chambers, in a closely synchronized and precisely measured manner. Various recipes are used in the manufacturing process and can require many discrete processing steps in which semiconductor devices are cleaned, polished, oxidized, masked, etched, doped, metallized, etc. The steps used, their partic...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C16/52C23C16/455C23C16/448G05D7/06
CPCC23C16/448C23C16/45523C23C16/45561G05D7/0647Y10T137/2863Y10T137/2842Y10T137/2836Y10T137/0379Y10T137/0396C23C16/52C23C16/455G05D7/06
Inventor 丁军华
Owner MKS INSTR INC