Bullet-proof plate with buffering isolation layer and manufacturing method thereof

A technology of isolation layer and bulletproof plate, applied in protective equipment, offensive equipment, armor plate structure and other directions, can solve the problems of long heat preservation and pressure holding time, low production efficiency, high surface density, and achieve less thickness specifications and improved production efficiency , the effect of low areal density

Inactive Publication Date: 2013-08-07
SURREY HI TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] 1. The thickness is too thick, the surface density is too high, and the quality is too large;
[0005] 2. The heat preservation and pressure holding time in the manufacturing process is too long, and the production efficiency is low

Method used

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  • Bullet-proof plate with buffering isolation layer and manufacturing method thereof
  • Bullet-proof plate with buffering isolation layer and manufacturing method thereof
  • Bullet-proof plate with buffering isolation layer and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] see figure 1 As shown, the bulletproof board 10 with a buffer isolation layer includes two layers of curved UHMWPE fiber bulletproof substrates 11a, 11b and a buffer isolation layer 12 disposed between the two layers of bulletproof substrates 11a, 11b.

[0045] see figure 1 , prepare the bulletproof board 10 containing the buffer isolation layer, the preparation method is: use ultra-high molecular weight polyethylene fiber as material, and prepare the bulletproof substrate by pressing and cutting. The two layers of bulletproof substrates 11a, 11b are stacked, and a certain space is left between the two layers of bulletproof substrates 11a, 11b and fixed. The medium of the buffer isolation layer 12 between the two bulletproof substrates 11a, 11b is air. The bulletproof board 10 with a buffer isolation layer is formed by stacking two layers of bulletproof substrates 11a and 11b, with a buffer isolation layer 12 between the two layers of bulletproof substrates 11a and 11...

Embodiment 2

[0049] see figure 2 As shown, the bulletproof board 20 with a buffer isolation layer includes two layers of curved UHMWPE fiber bulletproof substrates 21a, 21b and a buffer isolation layer 22 disposed between the two layers of bulletproof substrates 21a, 21b.

[0050] see figure 2, prepare the bulletproof board 20 containing the buffer isolation layer, the preparation method is: use ultra-high molecular weight polyethylene fiber as material, prepare the bulletproof substrate by pressing and cutting, and cut the polyethylene foam material according to the designed size. The two layers of bulletproof substrates 21a, 21b are laminated with polyethylene foam. The medium of the buffer isolation layer 22 between the two bulletproof substrates 21a, 21b is polyethylene foamed cotton. The bulletproof board 20 with a buffer isolation layer is formed by stacking two layers of bulletproof substrates 21a and 21b, and a buffer isolation layer 22 is formed between the two layers of bulle...

Embodiment 3

[0054] see image 3 As shown, the bulletproof board 30 containing the buffer isolation layer includes a curved plate-shaped ceramic bulletproof substrate 31a, two layers of curved plate-shaped ultra-high molecular weight polyethylene fiber bulletproof substrates 31b, 31c, and two layers of curved plate-shaped The buffer isolation layer 32 between the ultra-high molecular weight polyethylene fiber bulletproof substrates 31b, 31c.

[0055] see image 3 , to prepare the bulletproof board 30 containing the buffer isolation layer, the preparation method is: using bulletproof ceramics as the material, and preparing the ceramic bulletproof substrate 31a by cutting. Using ultra-high molecular weight polyethylene fibers as materials, the ultra-high molecular weight polyethylene fiber bulletproof substrates 31b and 31c are prepared by pressing and cutting. Two layers of ultra-high molecular weight polyethylene fiber bulletproof substrates 31b, 31c are stacked, and a certain space is l...

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PUM

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Abstract

The invention discloses a bullet-proof plate with a buffering isolation layer. The bullet-proof plate comprises at least one buffering isolation layer and at least two layers of bullet-proof substrates made of a high-performance fiber material. The buffering isolation layer is arranged between the two adjacent layers of bullet-proof substrates. A manufacturing method of the bullet-proof plate includes the following steps: (1) a bullet-proof substrate manufacturing step; (2) a buffering isolation layer manufacturing step; (3) an assembling and fixing step; and (4) a post-processing step. The bullet-proof plate with the buffering isolation layer has the advantage that under the same areal density, bullet-proof performance is higher; under the same protection level, areal density is lower, and the thickness is smaller; the bullet-proof plate suitable for different bullet-proof levels can be assembled flexibly through a few types of substrates of appropriate thickness specifications; and the bullet-proof substrate thickness specifications are fewer so that production is simplified, operation is convenient, production efficiency is improved, the production process is stable, and product quality is stable.

Description

technical field [0001] The invention relates to the field of bulletproof protective materials, in particular to a bulletproof plate with a buffer isolation layer and a preparation method thereof, which can be applied to bulletproof inserts, bulletproof armor plates or bulletproof shields. Background technique [0002] The bulletproof mechanism of the high-performance fiber bulletproof board is mainly: when the fiber is impacted, it will quickly spread the shock wave energy away, when the fiber breaks, it needs to absorb the fracture energy, and the overall bending deformation of the board and the slippage between the layers must absorb the warhead. Energy, these mechanisms work together to exhaust the kinetic energy of the warhead (or fragments), thereby achieving the purpose of bulletproofing. Among them, the energy absorbed by the overall deformation of the plate accounts for a relatively large proportion, which is the basic reason for the superior ballistic performance of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F41H1/02F41H5/04
Inventor 辛志荣卫甘霖于天廖振魁巩娜娟鲁品琦董建东辛春荣侯志辉
Owner SURREY HI TECH INC
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