LED flip-chip testing machine and testing method

Abstract

The invention provides an LED flip-chip testing machine and a testing method, which can test an LED flip-chip timely at the chip stage of flipping the LED chip, wherein the provided testing data can be taken as a basis for light splitting and color separation, and can objectively reflect the LED chip flipping technology. The LED flip-chip testing machine comprises a support part, wherein a working plate is connected to an X-Y-Z triaxial driving device through the support part, and a gap capable of accommodating a plate-shaped solar panel is reserved between the working plate and the X-Y-Z triaxial driving device; and the working plate is transparent, and during test, the plate-shaped solar panel can move to the position under the working plate and collects light emitted by the LED flip-chip. The LED flip-chip testing method is characterized in that the working plate is transparent, and the plate-shaped solar panel is used for collecting light emitted by the chip under the working plate. The solar panel is small in size and adopts a plane structure, so that mounting and moving operation is convenient, and during test, positioning is more accurate, and light leak is not easy.

Description

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AI Technical Summary

Problems solved by technology

[0003] Flip-chip LED chip products are packaged by ultrasonic bonding or reflow soldering. Usually, the test results of packaged products are used as the basis for measuring the performance of flip-chip LED products. Such testing methods have a certain lag and cannot be objectively reflected in the chip stage. The advantages and disadvantages of the flip-chip LED chip process cannot provide test d

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