LED flip-chip testing machine and testing method

Abstract

The invention provides an LED flip-chip testing machine and a testing method, which can test an LED flip-chip timely at the chip stage of flipping the LED chip, wherein the provided testing data can be taken as a basis for light splitting and color separation, and can objectively reflect the LED chip flipping technology. The LED flip-chip testing machine comprises a support part, wherein a working plate is connected to an X-Y-Z triaxial driving device through the support part, and a gap capable of accommodating a plate-shaped solar panel is reserved between the working plate and the X-Y-Z triaxial driving device; and the working plate is transparent, and during test, the plate-shaped solar panel can move to the position under the working plate and collects light emitted by the LED flip-chip. The LED flip-chip testing method is characterized in that the working plate is transparent, and the plate-shaped solar panel is used for collecting light emitted by the chip under the working plate. The solar panel is small in size and adopts a plane structure, so that mounting and moving operation is convenient, and during test, positioning is more accurate, and light leak is not easy.

Description

technical field [0001] The invention relates to a chip testing machine and a testing method, in particular to a flip-chip LED chip testing machine and testing method. Background technique [0002] Flip-chip LED chips are essentially based on the traditional technology. The light-emitting area and the electrode area of ​​the LED chip are not designed on the same plane. At this time, the electrode area is placed toward the bottom of the lamp cup, which can save the need for welding wires. a process. Compared with regular LED chips, flip-chip LED chips have the advantages of low voltage, high brightness, high reliability, high saturation current density, and better heat dissipation, and can integrate protection circuits on flip-chip substrates. , which is obviously helpful to chip reliability and performance. In addition, compared with the front-mounted and vertical structures, the flip-chip method is easier to realize ultra-high-power chip-level modules and multi-function in...

AI Technical Summary

Problems solved by technology

[0003] Flip-chip LED chip products are packaged by ultrasonic bonding or reflow soldering. Usually, the test results of packaged products are used as the basis for measuring the performance of flip-chip LED products. Such testing methods have a certain lag and cannot be objectively reflected in the chip stage. The advantages and disadvantages of the flip-chip LED chip process cannot provide test d

Images