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Enhanced flash multi-chip packaging chip, communication method and packaging method

A packaging method and multi-chip technology, applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problem of inconvenient adjustment of communication functions, etc.

Active Publication Date: 2016-03-30
GIGADEVICE SEMICON (BEIJING) INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] As the range of application functions of various electronic products increases, this integrated overall chip with SPIFLASH function and RPMC function is not convenient to adjust the SPIFLASH function or RPMC function and the communication function of the two.

Method used

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  • Enhanced flash multi-chip packaging chip, communication method and packaging method
  • Enhanced flash multi-chip packaging chip, communication method and packaging method
  • Enhanced flash multi-chip packaging chip, communication method and packaging method

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Embodiment Construction

[0021] In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0022] Embodiments of the present invention have shown a kind of package chip of the multi-chip of enhanced Flash of the present invention, comprise: be packaged with SPIFLASH chip and RPMC chip;

[0023] The SPIFLASH chip and the RPMC chip have interconnected inter-chip communication pins; wherein the communication pins are used to provide the other party with an identification of its own processing instruction status.

[0024] The packaged chip in the embodiment of the present invention can be adjusted according to the range of application functions of various electronic products due to the use of two independently designed SPIFLASH chips and RPMC chips, and the connection of communication pins between the chips is established. ...

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Abstract

The invention provides an enhanced Flash multi-chip packaged chip, and a communication method and a packaging method thereof. The enhanced Flash multi-chip packaged chip comprises an SPI FLASH chip and an RPMC chip which are packaged, wherein the SPI FLASH chip and RPMC chip are provided with communication pins which are arranged between the two chips and are mutually connected; and each communication pin is used for providing the identification of the processing instruction state of the communication pin for the opposite side. The invention further provides a communication method and a packaging method for the enhanced Flash multi-chip packaged chip. Since the two chips, adopted by the enhanced Flash multi-chip packaged chip, can be designed independently, and the communication connection between the two chips is established, the structure and function of each chip can be adjusted according to the range of the application functions of various products.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to an enhanced Flash multi-chip packaging chip, a communication method and a packaging method. Background technique [0002] The enhanced FLASH with ReplayProtectionMonotonicCounter (RPMC) is the basic input-output system (BasicInput-OutputSystem, BIOS) chip that Intel will push. It contains a large capacity SPIFLASH function and RPMC function. Among them, the capacity of SPIFLASH can be 8M, 16M, 32M, 64M, 128M, 256M or higher, which is used to store the code and data of CPUBIOS; the function of RPMC ensures the confidentiality and integrity of read and write data. The device with RPMC function and its integrated SPIFLASH constitute the hardware platform of the BIOS in the personal computer (PersonalComputer, PC) system. [0003] At present, when designing a chip with RPMC function, designers usually integrate large-capacity SPIFLASH and RPMC functions on one chip, that is, RPMC and ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/18H01L23/31H01L21/98
CPCH01L2224/05554H01L2224/48145H01L2224/48227H01L2224/49171
Inventor 胡洪舒清明张赛张建军刘江潘荣华
Owner GIGADEVICE SEMICON (BEIJING) INC
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