Manufacturing method for thin film chip antenna and structure of thin film chip antenna
A thin-film chip and manufacturing method technology, which is applied in the field of antennas, can solve the problems of increased cost, slow manufacturing speed, and difficulty in controlling the accuracy of chip antennas, etc.
Inactive Publication Date: 2013-08-14
TAI TECH ADVANCED ELECTRONICS CO LTD
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Problems solved by technology
[0004] After the above two chip antennas are manufactured, the chip antenna is large in size, and the accuracy of the chip antenna is difficult to control. It needs to be connected to the instrument for detection, repair and adjustment, resulting in slow production speed and increased cost. Moreover, when the chip antenna is too large , It also takes up too much installation space on the circuit board, and also causes troubles in subsequent processing and production
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[0120] The technical content and detailed description of the present invention are now described as follows in conjunction with the accompanying drawings:
[0121] see figure 1 , Figure 2a to Figure 2f , a schematic diagram of the fabrication process and structural fabrication process of the first metal layer of the thin film chip antenna of the present invention. As shown in the figure: the manufacture method of the film chip antenna of the present invention, at first, in step 100, the substrate 1 of the Al2O3 of a ceramic material (such as Figure 2a ).
[0122] Step 102 , cleaning the surface of the substrate 1 .
[0123] Step 104, after the substrate 1 is cleaned, a layer of titanium tungsten (TiW) and copper material (such as Figure 2b ) of the metal film 2a.
[0124] Step 106, coating or printing a photoresist layer 10 of a thin film on the surface of the metal film 2a (such as Figure 2c ).
[0125] Step 108, carry out exposure, development processing (as Fig...
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The invention discloses a manufacturing method for a thin film chip antenna and a structure of the thin film chip antenna. The method for manufacturing the chip antenna by a thin film process comprises the steps as follows: firstly, a substrate is prepared, and a first metal layer and a first insulating layer are formed on the surface of the substrate; then a second metal layer and a second insulating layer are formed on the other surface of the substrate, and an upper metal layer and a lower metal layer are manufactured on the surfaces of the first insulating layer and the second insulating layer; and finally, electrode layers are manufactured on two sides of the substrate and electrically connected with the upper metal layer and the lower metal layer, so that the thin film chip antenna is formed. The thin film chip antenna utilizes the first metal layer and the second metal layer to form the thin film chip antenna with capacitance characteristics through coupling.
Description
technical field [0001] The invention relates to an antenna, in particular to a manufacturing method and structure of a thin film chip antenna. Background technique [0002] In recent years, with the increasing demand for communication data volume, the rapid rise of wireless metropolitan area network (worldwide interoperability for microwave access, WiMAX), according to the predetermined standard of IEEE 802.16e, this WiMAX standard is applied to base stations and mobile devices For wireless transmission between laptops, smart phones, tablet computers, personal assistant devices, navigators, etc., the operating frequency band is 2-6 GHz to provide higher-quality multimedia audio-visual transmission and instant information exchange. [0003] The currently used chip antenna is a dielectric material with a multi-layer substrate structure, and metal patterns of different shapes such as spirals or meanders are formed on the surface of each layer of the substrate. The metal pattern...
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Inventor 简志宏
Owner TAI TECH ADVANCED ELECTRONICS CO LTD