Electroforming device for superfine pore plate

Abstract

The invention discloses an electroforming device for a superfine pore plate. The electroforming device comprises an electroforming box. The electroforming device is characterized in that the electroforming box is internally provided with a metal plate taken as an anode, and a core model taken as a cathode, and a vacuum air exhausting device is further connected onto the electroforming box. During electroforming, metal cations in electrolyte in the electroforming box obtain electrons which are settled on the core model of the cathode, and meanwhile the anode metal loses the electrons under the action of an electric field to enter the electrolyte, so that the concentration of the metal cations in the electrolyte is balanced, and therefore, the thicker and thicker metal settled layer can be settled on the core model as time delays, and the required thickness can be finally reached. The superfine electroforming environment is sealed and exhausted to a negative pressure condition by the vacuum air exhausting device. The atmospheric pressure of the superfine electroforming environment can be reduced, the hydrogen bubbles within solution can be preferably dissolved out, the probability and the quantity of the generation of the sedimentation defect such as pinholes can be reduced, and the electroforming effect can be improved.

Description

technical field [0001] The invention relates to an electroforming device, in particular to an electroforming device for a micro-orifice plate. Background technique [0002] Electroforming is a special processing method that uses the principle of electrolytic deposition of metals to accurately replicate certain complex or special-shaped workpieces. The specific steps are to use the electroforming mold made in advance according to the required shape as the cathode, and use the electroforming material as the anode, put them into the same metal salt solution as the anode material, and pass through the direct current. Under the action of electrolysis, the electroformed mold shows that the metal electroformed layer is gradually deposited, and after reaching the required thickness, it is taken out of the solution, and the electroformed layer is separated from the original mold to obtain a metal replica corresponding to the shape of the original mold. [0003] The electroforming of...

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Problems solved by technology

[0003] The electroforming of micro-orifice plates with a micro-groove structure with a large aspect ratio is a technical difficulty in the field of microfabrication. It is difficult to obtain high-quality electroformed devices using conventional electroforming methods. The root of the problem lies in the large aspect ratio. The transport of electrodeposition reaction substances in the deep trenches of the structure is severely hindered, and deposition defects such as pinholes are prone to occur

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