The invention discloses an 
electroforming device for a superfine pore plate. The 
electroforming device comprises an 
electroforming box. The electroforming device is characterized in that the electroforming box is internally provided with a 
metal plate taken as an 
anode, and a core model taken as a 
cathode, and a vacuum air exhausting device is further connected onto the electroforming box. During electroforming, 
metal cations in 
electrolyte in the electroforming box obtain electrons which are settled on the core model of the 
cathode, and meanwhile the 
anode metal loses the electrons under the action of an 
electric field to enter the 
electrolyte, so that the concentration of the metal cations in the 
electrolyte is balanced, and therefore, the thicker and thicker metal settled layer can be settled on the core model as 
time delays, and the required thickness can be finally reached. The superfine electroforming environment is sealed and exhausted to a negative pressure condition by the vacuum air exhausting device. The 
atmospheric pressure of the superfine electroforming environment can be reduced, the 
hydrogen bubbles within solution can be preferably dissolved out, the probability and the quantity of the generation of the 
sedimentation defect such as pinholes can be reduced, and the electroforming effect can be improved.