The invention discloses an
electroforming device for a superfine pore plate. The
electroforming device comprises an
electroforming box. The electroforming device is characterized in that the electroforming box is internally provided with a
metal plate taken as an
anode, and a core model taken as a
cathode, and a vacuum air exhausting device is further connected onto the electroforming box. During electroforming,
metal cations in
electrolyte in the electroforming box obtain electrons which are settled on the core model of the
cathode, and meanwhile the
anode metal loses the electrons under the action of an
electric field to enter the
electrolyte, so that the concentration of the metal cations in the
electrolyte is balanced, and therefore, the thicker and thicker metal settled layer can be settled on the core model as
time delays, and the required thickness can be finally reached. The superfine electroforming environment is sealed and exhausted to a negative pressure condition by the vacuum air exhausting device. The
atmospheric pressure of the superfine electroforming environment can be reduced, the
hydrogen bubbles within solution can be preferably dissolved out, the probability and the quantity of the generation of the
sedimentation defect such as pinholes can be reduced, and the electroforming effect can be improved.