The invention discloses an electroforming device for a superfine pore plate. The electroforming device comprises an electroforming box. The electroforming device is characterized in that the electroforming box is internally provided with a metal plate taken as an anode, and a core model taken as a cathode, and a vacuum air exhausting device is further connected onto the electroforming box. During electroforming, metal cations in electrolyte in the electroforming box obtain electrons which are settled on the core model of the cathode, and meanwhile the anode metal loses the electrons under the action of an electric field to enter the electrolyte, so that the concentration of the metal cations in the electrolyte is balanced, and therefore, the thicker and thicker metal settled layer can be settled on the core model as time delays, and the required thickness can be finally reached. The superfine electroforming environment is sealed and exhausted to a negative pressure condition by the vacuum air exhausting device. The atmospheric pressure of the superfine electroforming environment can be reduced, the hydrogen bubbles within solution can be preferably dissolved out, the probability and the quantity of the generation of the sedimentation defect such as pinholes can be reduced, and the electroforming effect can be improved.