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LED (light-emitting diode) packaging structure and packaging method thereof

A technology for LED packaging and LED chips, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of complex structure and manufacturing process, and achieve the effects of simplified packaging structure and process steps, enhanced stability, and simple structure

Inactive Publication Date: 2013-09-04
XIAMEN LEE BROS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, since the LED chip needs to be electrically connected to the first lead frame and the second lead frame by wire bonding, the structure and manufacturing process are relatively complicated.

Method used

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  • LED (light-emitting diode) packaging structure and packaging method thereof
  • LED (light-emitting diode) packaging structure and packaging method thereof
  • LED (light-emitting diode) packaging structure and packaging method thereof

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Experimental program
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Embodiment Construction

[0012] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0013] Figure 1 to Figure 4 It is a schematic diagram of the LED packaging structure and packaging method of the present invention. Figure 4 It is a front view of the LED packaging structure 100 after the packaging is completed. The LED packaging structure 100 includes two LED chips 40 , one substrate 12 , four chip electrodes 20 , two external electrodes 30 , two insulating strips 162 , and one conductive layer 14 . The LED chip 40 and the substrate 12 are packaged and fixed by an encapsulation layer (not shown in the figure).

[0014] Please refer to figure 2 , the substrate 12 is made of transparent or translucent material, such as transparent ceramics. A conductive layer 14 is coated on the substrate 12 , and the conductive layer 14 is made of transparent indium tin oxide (ITO) material. The light emitted by the LED chips ...

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PUM

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Abstract

The invention discloses an LED (light-emitting diode) packaging structure and a packaging method thereof. The LED packaging structure comprises at least one LED chip and a substrate and is characterized in that the LED packaging structure further comprises a plurality of sections of electroconductive layers arranged corresponding to the LED chip; the electroconductive layers are arranged on the top surface of the substrate and separated from each other to form an insulating tape; the electroconductive layers on two sides of each insulating tape are provided with a chip electrode respectively; and the two chip electrodes arranged on two sides of each insulating tape are electrically connected with one LED chip respectively. The LED packaging structure and the packaging method thereof disclosed by the invention have the advantage of simple structure.

Description

technical field [0001] The invention relates to the technical field of LED packaging, in particular to an LED packaging structure and a packaging method thereof. Background technique [0002] There are many packaging methods for LEDs. At present, a common packaging method in the industry is: first fix the LED chip on a substrate, and then use the packaging layer to package the LED chip on the substrate to form a whole. For example, the invention with application number 200810002321.X filed on January 18, 2008 discloses an LED package. The LED package includes: a package body including a recess formed as a mounting portion; a first lead frame and a second lead frame mounted on the package body so as to be exposed at a lower surface of the recess; an LED chip mounted on a lower surface of the recess to be electrically connected to the first lead frame and the second lead frame; and a sealant formed by mixing a transparent resin and a phosphor and formed inside the recess to s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/62H01L25/075
Inventor 黄斌郭伟杰王霞
Owner XIAMEN LEE BROS CO LTD