Heat pipe and processing method thereof, and electronic equipment employing heat pipe

Abstract

The invention discloses a heat pipe. The heat pipe comprises a pipe casing as well as a pipe core composed of first flow channels with liquid phase medium and second flow channels with gas phase medium and arranged in the pipe casing, wherein the pipe core comprises a first pipe section and a second pipe section; in the first pipe section, the second flow channel is wrapped by the first flow channel; and in the second pipe section, the first flow channel and the second flow channel are arranged in parallel. The heat pipe provided by the invention can effectively reduce flow resistance of steam through the improvement of the structure arrangement of the pipe core; an excellent heat dissipation capacity is obtained, while the overall size of the heat pipe can be controlled to the largest extent, so that the possibility for realizing excellent heat dissipation of high-performance notebook computers as well as the application of the heat pipe to tablet computers with smaller space is reliably guaranteed. On the base of the heat pipe, the invention further provides electronic equipment employing the heat pipe and a processing method of the heat pipe.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a heat pipe, a processing method thereof and electronic equipment with the heat pipe. Background technique [0002] As we all know, good heat dissipation can ensure the working stability of each component of the electronic product system. To ensure good heat dissipation of each component, the corresponding heat dissipation configuration needs to occupy the necessary design space. However, with the development of science and technology and the improvement of application requirements, miniaturized and integrated electronic products are constantly being introduced. Due to the improvement of the integration degree of electronic components, the heat dissipation power per unit area must also increase accordingly. Therefore, highly integrated electronic components When working, its surface temperature will rise rapidly. As a result, there is a conflict between heat dissipation perf...

AI Technical Summary

Problems solved by technology

Due to the limited thermal conductivity of the shell and thermal diffusion materials, the power of CPU and other chips cannot be too high, which limits the performance improvement of the whole machine

[0005] In view of this, it is urgent to optimize the structural design of the existing heat pipes to effectively solve the defects in the existing technology that the heat dissipation performance and external dimensions cannot be effectively controlled.

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