Halogen-free low-temperature tinol

A solder paste, low-temperature technology, applied in the field of halogen-free low-temperature solder paste, can solve the problems of many residues, easy ionization, adverse effects on product mechanical properties and electrical properties, etc., to achieve no residue, high wetting force and expansion The effect of high efficiency and strong stability

Inactive Publication Date: 2013-09-18
WUXI CAIYUN MACHINERY & EQUIP
View PDF0 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, most of the active agents currently used to prepare the solder paste contain amine salts of halogens, which leave a lot of residue after soldering and are easily ionized, which has potential adverse effects on the mechanical and electrical properties of the product

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0011] The preferred embodiments of the present invention are described in detail below, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, so as to define the protection scope of the present invention more clearly.

[0012] Embodiments of the invention include:

[0013] A halogen-free low-temperature tin solder paste, comprising the following components by mass percentage: solder powder 85-95%, preferably 89%, flux 5-15%, preferably 11%; the solder powder is Sn-Bi A series of solder powder, the flux is composed of the following components by mass percentage: solvent 35-45%, film-forming agent 35-45%, activator 5-10%, thixotropic agent 1-5%, antioxidant 1 -2%, other 1-3%.

[0014] Wherein, the solvent is an alcohol ether solvent, which is an oxygen-containing solvent and can maintain the leveling property of the solder film.

[0015] The film formers include long-chain alkanes and long-chain fatty acid este...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses halogen-free low-temperature tinol which comprises the following components by mass percent: 85-95% of solder powder and 5-15% of scaling powder, wherein the solder powder is Sn-Bi series solder powder, and the scaling powder comprises the following components by mass percent: 35-45% of solvent, 35-45% of film forming agent, 5-10% of active agent, 1-5% of thixotropic agent, 1-2% of antioxygen and 1-3% of the balance. With the adoption of the mode, the stability of the tinol can be improved; the tinol has very high wetting power and a very high expansion rate; and no residue is remained after soldering.

Description

technical field [0001] The invention relates to the field of solder paste, in particular to a halogen-free low-temperature solder paste. Background technique [0002] With the implementation of lead-free electronic products, Sn-Bi series solder has the characteristics of being able to prepare alloys in a wide temperature range from 138°C eutectic point to 232°C, and can be assembled at about 160°C. -Compared with traditional SnPb solder, Bi series solder has the same elastic modulus in a wide temperature range, and its tensile strength and creep resistance are even better than the latter. Coupled with its moderate price and abundant raw materials, it can quickly replace SnPb solder in low-temperature assembly occasions and become the main substitute for low-temperature brazing. [0003] However, most of the activators currently used to prepare the solder paste contain amine salts of halogens, which leave a lot of residue after soldering and are easily ionized, which has pot...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363
Inventor 张晓明
Owner WUXI CAIYUN MACHINERY & EQUIP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap