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Base plate for stacked packaging

A stacked packaging and substrate technology, applied in semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problem of limited interconnection density of upper and lower packaging

Inactive Publication Date: 2013-09-18
NAT CENT FOR ADVANCED PACKAGING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a substrate for stacked packaging, which solves the problem of limited interconnection density between upper and lower packages in traditional stacked packaging

Method used

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  • Base plate for stacked packaging
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Embodiment Construction

[0023] In the following, in combination with the accompanying drawings in the embodiments of the present invention, the technical solutions in the embodiments of the present invention are clearly and completely expressed mainly by taking the substrate with a first-order cavity on one side as an example. The described embodiments are only part of the implementation of the present invention. example.

[0024] Figures 1 to 3 , are several structural forms of substrates used for stacked packaging provided by the embodiments of the present invention. In order, one side of the substrate has a first-order cavity, both sides have first-order cavities, and one side has second-order cavities. Figure 4 It is a schematic diagram of the structure of the substrate in the case of closed dams in the substrate provided by the embodiment of the present invention.

[0025] The substrate for package-on-package provided by the embodiments of the present invention may be an organic substrate or ...

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Abstract

The invention discloses a base plate for stacked packaging. The surface of the base plate comprises more than one concave cavity. According to the base plate for stacked packaging provided by the invention, concave cavities are arranged on one side or both sides of the base plate, and the cavities are used for assembling chips. A certain difference in heights of the interior of each cavity and the edge of the base plate exists, interconnection solder balls are arranged on the edge of the base plate, and the interconnection solder balls with narrow pitches and small diameters can be allowed to be adopted, so that the interconnection density between two layers of packaging units can be improved.

Description

technical field [0001] The invention relates to the technical field of stack packaging in three-dimensional packaging, in particular to a substrate used in stack packaging. Background technique [0002] Three-dimensional packaging, as a packaging form that conforms to the development of consumer electronics towards high integration, multi-function, and miniaturization, has been in-depth research, and chip stacking technology (stacked die), stacked packaging technology (package-on- package, PoP), built-in packaging technology (package-in-package, PiP), through-silicon via (through silicon via, TSV) and other implementation forms, three-dimensional packaging can effectively improve packaging density, save assembly space on the PCB, and can Meet the requirements of integrating more functions in the case of small changes in the appearance and size of consumer electronics. Stacked packaging is a new package formed by stacking the lower packaging unit and the upper packaging unit...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/498
CPCH01L2924/15311H01L2224/16225H01L2224/73204H01L2924/15153
Inventor 孙晓峰万里兮
Owner NAT CENT FOR ADVANCED PACKAGING
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