Manufacturing method of multilayer flexible wiring board

Abstract

The invention provides a manufacturing method of a multi-layer flexible distributing board, which can be used to prevent the peeling of the coating membrane attached to the insulation base material side of the cable part, and prevent the adhesive interlamination peeling of the installation part caused by the peeling of the coating membrane, and the scattering of the coating membrane. The multi-layer flexible distributing board comprises a cable part and a part installation part. A single side of the cable part is provided with a wiring pattern covered by the insulation covering membrane, and the other side of the cable part can be exposed from a base bottom side of the insulation base material of a core base plate part. During the forming of the internal layer of the circuit pattern, a residual pattern of a metal conductor is disposed on the exposed surface of the insulation base material of the cable part. During the coating forming of an interlamination connecting part, the coating can be carried out on the exposed surface of the insulation base material across the residual pattern. And during the forming of an external circuit pattern, the coating membrane and the residual pattern can be removed to expose the insulation base material.

Description

technical field [0001] The present invention relates to a flexible wiring board, and more particularly, to a method for manufacturing a flexible wiring board having a multi-layer structure of a cable portion and a component mounting portion. Background technique [0002] As such a multilayer flexible wiring board in the prior art, for example, there are known image 3 The product shown in (A). [0003] That is, in the multilayer circuit board having the four-layer structure of the cable part 110 and the component mounting part 120, as shown in the figure, the core board part on which the circuit patterns of the second layer L2 and the third layer L3 from the top are formed is 130 laminates the outer layer substrate portion 140 to constitute the component mounting portion 120 . The cable part 110 is constituted by the core board part 130, but in the cable part 130, the wiring L31 connecting the component mounting parts 120 is provided on the third layer L3 side, and on the s...

AI Technical Summary

Problems solved by technology

When the outer layer adhesive 142 is delaminated as described above, when the outer layer circuit pattern is formed in the next process, the alkaline chemical solution for removing the resist will infiltrate the peeled part, resulting in corrosion of the circuit pattern.

[0011] The peeled and swollen coating film 180 falls off, and the peeled pieces 183 disperse and contaminate the surroundings. In the process after coating, they come into contact with other substrates, causing defects such as short circuits due to conductive foreign matter.

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