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Attachment apparatus and attachment method

A bonding device and display device technology, applied in lamination devices, chemical instruments and methods, optics, etc., to achieve the effects of cost saving, uniform bonding thickness, and flow suppression

Inactive Publication Date: 2013-09-25
SHIBAURA MECHATRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, the adhesive supplied to the workpiece flows and easily overflows from the workpiece

Method used

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  • Attachment apparatus and attachment method
  • Attachment apparatus and attachment method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0042] Embodiments of the present invention (hereinafter referred to as embodiments) will be specifically described with reference to the drawings.

[0043] [A. Structure]

[0044] First, the structure of the adhesive supply device (hereinafter referred to as the present device) of the present embodiment will be described. Such as Figure 1~3 As shown, this device has an adhesive supply unit 1, a bonding unit 2, and the like. The workpiece S1 to be bonded is provided so as to be able to move between the adhesive supply part 1 and the bonding part 2 via the conveyance part 3 .

[0045] As the adhesive used in this embodiment, for example, an ultraviolet (UV) curable resin can be considered. Such as figure 1 As shown, the adhesive supply unit 1 has a supply unit 10 and the like. The supply part 10 is equipped with the dispenser (dispenser) which drips the adhesive agent R accommodated in the tank T on the work S1 via piping, for example. The dispenser is configured to be m...

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PUM

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Abstract

The invention provides an attachment apparatus and an attachment method, wherein flow of an attached adhesive can be prevent so as to ensure a uniform attachment thickness. In the attachment apparatus, a pair of work-pieces (S1) and (S2) for forming a liquid crystal display are attached through an ultraviolet-curable adhesive (R). The attachment apparatus comprises: an adhesive supply part (1) for supplying the adhesive (R) for the single surface of at least the one work-piece (S1), an attachment part (2) for attaching the work-piece (S2) on the adhesive (R), and an irradiation part (23) for irradiating UV light on the part or all of the whole adhesive (R) distributed between the attached work-piece (S1) and the attached work-piece (S2) to temporarily cure.

Description

technical field [0001] The present invention relates to a bonding device and a bonding method in which, for example, a technique of supplying an adhesive to a workpiece for bonding a workpiece constituting a display device is improved. Background technique [0002] Generally, a liquid crystal display is constituted by laminating a liquid crystal module, a touch panel for operation, a protective panel (cover panel) for protecting the surface, and the like. These liquid crystal modules, touch panels, protective panels, and the like (hereinafter referred to as workpieces) are mounted in the housing of the liquid crystal display. [0003] In bonding such workpieces, there are methods using an adhesive sheet and a method using a resin adhesive. The adhesive sheet is relatively expensive compared with an adhesive, and requires steps such as peeling of a release paper. Therefore, lamination using an adhesive has gradually become the mainstream in view of demand for cost reduction...

Claims

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Application Information

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IPC IPC(8): B32B37/12G02F1/1333
Inventor 横田典之
Owner SHIBAURA MECHATRONICS CORP
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