Conductive fine powder, conductive paste and electronic component
A technology of electronic components and conductivity, which is applied in the direction of conductive materials dispersed in non-conductive inorganic materials, parts of fixed capacitors, electrical components, etc., and can solve the gap between metal particles, the deterioration of electrical characteristics of electronic components, and the burial of metal particles, etc. problems, to achieve high coverage, inhibit electrode cracking, and improve the filling rate
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[0039] refer to figure 1 , The conductive fine powder of the present invention contains flat metal / alloy fine particles 1 . The flat metal / alloy fine particles 1 have a nanocomposite structure in which crystalline or amorphous nanoparticles 112 are mixed or generated in a base material, the maximum thickness T1 is 50 nm or less, and the maximum diameter D1 is more than twice the thickness. The thickness of the flat metal / alloy particles 1 does not need to be uniform as a whole, and can vary between the maximum thickness T11 and the minimum thickness T12.
[0040] Figure 2 to Figure 5 is a diagram schematically showing a nanocomposite structure. figure 2 The shown form is, for example, a form in which nano-sized crystalline or amorphous nanoparticles 112 are dispersed inside a base material structure 111 which is a crystalline structure. In addition, it is also possible to form a form in which nanoparticles 112 are dispersed in the grain boundaries of the matrix structure ...
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