Device for delivering wafers processed in a plurality of chambers

A transfer device and wafer technology, which is applied in transportation and packaging, electrical components, semiconductor/solid-state device manufacturing, etc., can solve problems such as cross-contamination, improve efficiency, avoid cross-contamination of liquid medicine, and avoid being twisted. Effect

Inactive Publication Date: 2013-09-25
THE 45TH RES INST OF CETC
View PDF4 Cites 11 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The object of the present invention is to provide a wafer transfer device for multi-chamber processing, which can solve the problem of cross-contamination caused by traditional wafer transfer devices when transferring in multiple different chambers

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Device for delivering wafers processed in a plurality of chambers
  • Device for delivering wafers processed in a plurality of chambers
  • Device for delivering wafers processed in a plurality of chambers

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0034] The technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings.

[0035] Such as Figure 1-8As shown, the wafer transfer device mainly includes a lifting motor 2, a lead screw 4, a lifting platform 13, a rotating motor 18, a rotating platform 23, at least three mechanical grippers, and the same number of mechanical grippers for driving the mechanical grippers. The driving mechanism; wherein, the output end of the lifting motor 2 is connected with the screw 4 through the coupling 3, the lifting platform 13 is installed on the screw 4 and the guide rail Z7, and the lifting motor 2 rotates to drive the lifting platform 13 to move up and down; the rotating motor The stator of 18 is installed on the lifting platform 13, and the rotary platform 23 is installed on the rotor of the rotary motor 18, and the rotary platform 23 is driven to rotate when the rotary motor 18 rotates. connected; the drivin...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to the technology of delivering wafers in the semiconductor wafer machining process, in particular to a device for delivering the wafers processed in a plurality of chambers. The device mainly comprises a lifting motor, a lead screw, a lifting platform, a rotating motor, a rotating platform, at least three mechanical claws and driving mechanisms, wherein the driving mechanisms are used for driving the mechanical claws, and the number of the driving mechanisms is the same as the number of the mechanism claws. The device can go up and down, rotate and stretch out or draw back at the same time, the movement in the three directions is carried out in unit time, therefore, the wafers can be delivered to expected positions rapidly and accurately. Further, due to the fact that at least three mechanical claws are arranged, the problems that the wafers are cross-contaminated, the wafers are lifted too low, the delivering speed is low and the delivering efficiency is low when the wafers are delivered by a traditional wafer delivery device among a plurality of chambers are solved.

Description

technical field [0001] The invention relates to a semiconductor wafer manufacturing process, in particular to a wafer transfer device of a fully automatic single wafer wet processing equipment with multiple manipulators. Background technique [0002] In the semiconductor wafer manufacturing process, the wafer needs to be transferred between each station. With the increase of the complexity of the wafer processing process, it is often necessary to process the wafer in multiple different chambers. For processing, different chemical liquids are used between different chambers. Traditional single or double robotic grippers are used. The same robotic gripper will be reused in different chambers. Since different chambers have different process functions, so The chemical liquid used is also different. The same robotic gripper will transfer the chemical liquid from the previous chamber to the next chamber, which will cause cross-contamination of wafers in different chambers, which c...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677H01L21/687
Inventor 陈仲武宋文超宫晨姚立新张乾
Owner THE 45TH RES INST OF CETC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap