Design of COB (Chip on Board) module group with high light extraction rate
A technology of mold loading and light rate, applied in electrical components, circuits, semiconductor devices, etc., can solve problems such as reducing module reliability, high voltage breakdown of LED chips, and blackening of silver pads.
Inactive Publication Date: 2013-10-23
SHANGHAI TOPLITE TECH
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Problems solved by technology
At present, in order to improve the light output rate of the substrate, there are mainly two kinds of substrates used in the popular COB packaging: one is to plate silver on the metal substrate, and then the LED chip is solidified on the silver pad. The plate is easily oxidized by sulfur and turns black, which gradually reduces the light output rate of the module; the second is to dig grooves and polish on the aluminum substrate, and then solidify the LED bare chip in the polished groove. The disadvantage is that the LED chip is easily damaged by high voltage. Breakdown, reducing the reliability of the entire module
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Embodiment Construction
[0006] Embodiments of the present invention will be further described below in conjunction with the accompanying drawings.
[0007] see figure 1 with figure 2 , a method of combining LED bare chips, highly reflective chrome-plated copper cups and grooved ceramic substrates into a high light output module, which is characterized in that the LED bare chips are solidified in highly reflective chrome-plated copper cups, and then The chrome-plated copper cup is inlaid on the grooved ceramic substrate through heat-conducting silica gel and other heat-conducting materials. The operation steps are as follows:
[0008] In the present invention, the highly reflective chrome-plated copper cup (3) treated by the electroplating process is fixed and embedded on the ceramic substrate (1) with grooves through heat-conducting silica gel and other heat-conducting materials, and the LED bare chips (4) are arranged in a rectangular array or any other In the form of solid crystal, in the highl...
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The invention relates to a COB packaging module group with a high light extraction rate. Design of the module group comprises the steps that a chrome plated copper cup (3) with high reflective property which is processed by electroplating technology is fixedly embedded into a ceramic substrate (1) with a groove via heat conductive materials such as heat conductive silica gel; bare LED (Light-Emitting Diode) chips (4) are bounded in the chrome plated copper cup (3) with high reflective property in a rectangular array or any other form; gold wiring is directly carried out on electrodes of the bare LED chips (4) and metal pads (2) of the ceramic substrate to connect the bare LED chips (4) in series or parallel; and the inner of the chrome plated copper cup (3) is coated with phosphor. Thus, the integrated COB packaging module group with the high light extraction rate is formed.
Description
technical field [0001] The invention relates to a COB packaging module with high light extraction rate, in particular to a design combining an LED bare chip, a highly reflective chrome-plated copper cup and a ceramic substrate. Background technique [0002] The emergence of COB packaging technology has realized the high integration of LED chips. In recent years, the heat dissipation problem of LED chips using COB packaging technology has been gradually solved. However, the low light output rate has always plagued the majority of COB packaging manufacturers. How to improve the light extraction rate of the substrate used in COB packaging has been mentioned and discussed many times in the industry. At present, in order to improve the light output rate of the substrate, there are mainly two kinds of substrates used in the popular COB packaging: one is to plate silver on the metal substrate, and then the LED chip is solidified on the silver pad. The plate is easily oxidized by s...
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IPC IPC(8): H01L33/00
Inventor 李建胜
Owner SHANGHAI TOPLITE TECH