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A kind of manufacturing method of pcb board and pcb board

A technology for a PCB board and a manufacturing method, which is applied to the formation of electrical connection of printed components, electrical connection of printed components, printed circuit components, etc., can solve the problems of high processing cost, reduced layout density, and multiple PCB surface areas, and achieves reduced processing. cost, avoid investment, improve the effect of layout density

Active Publication Date: 2016-03-30
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] First, this kind of back drilling equipment is a special equipment compared with ordinary drilling equipment, and the input cost is relatively high, the factory building occupies a relatively large space, and at the same time, it must be equipped with skilled operators, etc., which leads to relatively high PCB processing costs. high;
[0006] Second, at the same time as back drilling, the substrate around the hole will also be drilled (such as figure 2 As shown), this requires that when designing the layout of the holes on the PCB, it is necessary to reserve a back-drilling space (referring to the radial space along the via hole) on the substrate around the holes, and the back-drilling space will occupy more of the PCB surface area, resulting in reduced layout density

Method used

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  • A kind of manufacturing method of pcb board and pcb board
  • A kind of manufacturing method of pcb board and pcb board
  • A kind of manufacturing method of pcb board and pcb board

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] image 3 It is a schematic flow chart of a method for manufacturing a PCB board provided by the first embodiment of the present invention. Such as image 3 As shown, the manufacturing method of the PCB board includes:

[0042] S10. Pasting a dry film on the surface of the metal layer of the PCB with via holes, the dry film covering the via holes of the orifice plate to be removed;

[0043] S12. Remove the dry film covering the via holes of the orifice disk to be removed, so that the via holes of the orifice disk to be removed are exposed;

[0044] S12: Perform etching on the orifice disk of the via hole of the orifice disk to be removed by an etching process, so that the via hole forms a non-porous disk via hole.

[0045] In this way, it can be seen that the present invention replaces the mechanical back-drilling process with an etching process. On the one hand, it can avoid the investment of back-drilling equipment, thereby reducing the processing cost of the PCB; The materia...

Embodiment 2

[0048] Such as Figure 4 As shown, the PCB manufacturing method specifically includes:

[0049] S20. Laminate multiple single-layer boards or double-sided boards through a laminating process to produce a circuit pattern to be processed and a PCB board to be drilled 1 to form Figure 6a The state shown;

[0050] Generally speaking, the outer layer and the inner layer of the PCB board 1 are bonded by a prepreg to form a board to be pressed, and then the board to be pressed is pressed together to form the circuit pattern to be processed and the PCB board 1 to be drilled.

[0051] However, when the metal layer 2 is very thick, the metal layer 2 can be etched through an etching process to make the thickness of the metal layer 2 on the surface of the PCB board 1 thinner, which can reduce the difficulty of etching when the metal layer 2 in the exposed area is subsequently etched, and The accuracy of the outer circuit pattern of the PCB board 1 can be further improved. For the metal layer, ...

Embodiment 3

[0074] Such as Figure 5 As shown, the PCB manufacturing method specifically includes:

[0075] S30. Laminate multiple single-layer boards or double-sided boards through a laminating process to produce a circuit pattern to be processed and a PCB board to be drilled 1'to form Figure 7a The state shown;

[0076] S31, such as Figure 7b Make a via 4'on the PCB board 1'after the aforementioned steps;

[0077] S32, such as Figure 7c As shown, the via hole to be removed in the PCB board 1'is filled with resin 6'through the resin plugging process;

[0078] S33, such as Figure 7d As shown, a dry film 7'is pasted on the surface of the metal layer 2'of the PCB, wherein the dry film 7'covers the via hole of the orifice plate to be removed;

[0079] Steps S30 to S34 can refer to the content described in steps S20 to S24 of the first embodiment, so the description of steps S30 to S34 will not be repeated here.

[0080] S34. Expose the PCB with the dry film attached to obtain an exposed area and an...

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Abstract

The invention discloses a manufacturing method of a PCB (Printed Circuit Board) and the PCB, which relate to the technical field of PCBs and are invented to reduce the processing cost of the PCB and increase the layout density of via holes. The method comprises the following steps: firstly, sticking a dry film to the surface of a metal layer on a PCB provided with via holes, wherein the dry film is covered on the via holes from which hole plates are to be removed; secondly, removing the dry film covered on the via holes from which the hole plates are to be removed so as to expose the via holes from which the hole plates are to be removed; and lastly, etching the hole plates of the via holes from which the hole plates are to be removed via an etching process to form via holes without hole plates. The method is mainly used for forming via holes without hole plates in PCBs.

Description

Technical field [0001] The invention relates to the technical field of PCBs, in particular to a manufacturing method of a PCB board and a PCB board. Background technique [0002] PCB (Printed Circuit Board, printed circuit board) is one of the important electronic components in the electronics industry. It is not only a carrier of electronic components, but also a provider of electrical interconnection between electronic components. Nowadays, PCB has developed from the initial single-layer board to double-sided and multi-layer boards. Among them, multi-layer boards are widely used because of their high assembly density, small size, high signal transmission speed, and easy wiring. [0003] Multilayer boards are made by etched multiple single-layer boards or double-sided boards through lamination, bonding and other processes. In order to achieve electrical connection between layers, vias are generally made on the PCB. The process method of the via hole includes: firstly, drill holes...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/40H05K1/11
Inventor 陈立宇罗宗浪张霞
Owner HUAWEI TECH CO LTD