Combined heat dissipation module

Abstract

The invention discloses a combined heat dissipation module which comprises a substrate, a plurality of cooling fins arranged on the substrate and a connecting rod. The cooling fins are arranged on the substrate in a matrix shape; air passages are formed between the cooling fins; the surfaces of the cooling fins are all in a wave shape; the connecting rod is in a Z shape; both ends of the Z-shaped connecting rod are provided with a snap; the Z-shaped connecting rod can be inserted into a space between the cooling fins which are arranged in a matrix shape; and one corner of the substrate is an oblique angle. By the mode, effective position avoidance can be implemented in an installing process; and the connecting rod is connected with a main body which needs to be subjected to heat dissipation, so that the heat dissipation module is tightly combined with the main body which needs to be subjected to heat dissipation, and thus, heat adsorption and conduction efficiency and stability are improved.

Description

technical field [0001] The invention relates to the field of radiators, in particular to a combined heat dissipation module capable of avoiding positions. Background technique [0002] With the continuous advancement of integrated circuit technology and the continuous improvement of industrial application requirements, the electronic information industry is booming and rapid, the application of computers is popularized, and the speed of its replacement is accelerating. Therefore, the core component of the computer - the central processing unit The operating frequency is getting higher and higher, and high-frequency and high-speed processors are continuously introduced, but the higher the operating frequency of the processor, the more heat it generates per unit time, and the accumulation of heat will cause the temperature to rise, resulting in a decrease in its operating performance including stability Therefore, it is necessary to dissipate the heat generated by it in time. ...

AI Technical Summary

Problems solved by technology

The buckle usually includes fixing parts such as a buckle, a pressure rod, and a screw. Since the installation part has more fixing parts, the assembly of the radiator is more troublesome, and its production and assembly costs are also relatively high.

Of course, there are also heat sinks that are formed by combining the aluminum substrate and the heat dissipation fins on the aluminum substrate. The position is different, and sometimes it is necessary to avoid the position during the installation process. Since the arrangement of the heat dissipation fins on the aluminum substrate is fixed, it is not easy to avoid the position.

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