Heat sink and method of making the same
A technology of a heat dissipation device and a manufacturing method, which is applied in the direction of cooling/ventilation/heating transformation, etc., can solve the problems that the type of heat dissipation fins cannot be easily changed, and the production cost cannot be reduced, so as to reduce the complexity and the manpower consumed, improve Production efficiency, the effect of reducing production costs
Active Publication Date: 2016-12-14
GIGA BYTE TECH CO LTD
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Problems solved by technology
[0006] In view of the above problems, the present invention provides a heat dissipation device and a manufacturing method thereof. The same heat dissipation fins are stacked or arranged in different ways to achieve different heat dissipation effects, thereby solving the problem of heat dissipation fin types of conventional heat dissipation devices. It cannot be easily changed, so that the production cost cannot be reduced
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Embodiment Construction
[0051] The heat dissipation device involved in the present invention includes the first embodiment and the second embodiment. The manufacturing methods of the heat dissipation devices corresponding to different embodiments are naturally different. Therefore, the following paragraphs will discuss the first embodiment and the second embodiment respectively. The structure of the heat sink and its manufacturing method will be described.
[0052] Please refer to Figure 8 , and also refer to Figure 1 to Figure 7 , in the first embodiment, the manufacturing method of the heat dissipation device includes the following steps: first, provide a plurality of first heat dissipation fins 100, second heat dissipation fins 200 and a fixing component 300 (S501), so that the first embodiment The heat dissipation device 10 includes a plurality of first heat dissipation fins 100 , a plurality of second heat dissipation fins 200 and a fixing component 300 as mentioned above. It should be noted...
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The invention relates to a cooling device and a manufacturing method thereof. The cooling device comprises a plurality of first cooling fins, a plurality of second cooling fins and a fixing assembly. Each first cooling fin of the cooling device comprises a first through hole, and the first cooling fins are arranged at intervals. Each second cooling fin comprises a second through hole, the second cooling fins are in the same shapes as the first cooling fins, and each second cooling fin is installed between two adjacent first cooling fins in an inverted mode. The fixing assembly penetrates the first through holes of the first cooling fins and the second through holes of the second cooling fins respectively, and the fixing assembly is pushed against and used for fixing the first cooling fins and the second cooling fins. According to the cooling device, the cooling fins of different shapes / specifications are not required to be designed and manufactured again, and the cooling area and the airflow flowing efficiency of the cooling device can be changed simply and quickly.
Description
【Technical field】 [0001] The invention relates to a heat dissipation device and a manufacturing method thereof, in particular to a manufacturing method in which heat dissipation fins of the same shape are arranged in different directions to form different types of heat dissipation device structures. 【Background technique】 [0002] With the continuous development of the electronic information industry, the operating frequency and calculation volume of electronic equipment continue to increase. However, along with the high operating frequency and high computing load, the heat generated by the electronic equipment is also increased, which makes the temperature of the electronic equipment itself and its surroundings continue to rise, which seriously threatens its operating performance. In order to ensure the normal operation of electronic equipment, a large amount of waste heat generated by electronic equipment must be discharged in time to avoid overheating of electronic equipm...
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IPC IPC(8): H05K7/20
Inventor 毛黛娟
Owner GIGA BYTE TECH CO LTD