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Heating control device for achieving package equipment by using Omron temperature control module

A heating control device and packaging equipment technology, applied in temperature control, non-electric variable control, control/regulation system, etc., can solve problems such as uncontrollable temperature, product scrapping, temperature control accuracy cannot be guaranteed, etc., and achieve the goal of ensuring stability Effect

Inactive Publication Date: 2013-11-20
TONGLING FUSHI SANJIA MACHINE
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The disadvantages of adopting the above method are: firstly, when an error occurs in the temperature control device, the PID algorithm will stop working, causing the temperature to be in an uncontrollable state, and thus the phenomenon of product scrapping is very likely to occur; secondly, the control accuracy of the temperature cannot be guaranteed; Third, when the line is disconnected, the alarm prompt cannot be given in time

Method used

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  • Heating control device for achieving package equipment by using Omron temperature control module
  • Heating control device for achieving package equipment by using Omron temperature control module
  • Heating control device for achieving package equipment by using Omron temperature control module

Examples

Experimental program
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Embodiment Construction

[0026] Such as figure 1 , 2 As shown, a heating control device for packaging equipment, the heating control device includes a temperature measuring component 10, the output end of the temperature measuring component 10 is connected to the input end of the temperature control module 20, and the output end of the temperature control module 20 is connected to the relay 30, and the power supply circuit at the control end of the relay 30 is provided with a heating element 40.

[0027] The input end of the temperature control module 20 is connected to the output end of the communication module 50 , and the input end of the communication module 50 is connected to the output end of the controller 60 .

[0028] Preferably, the temperature measuring component 10 is a thermocouple; the relay 30 is a solid state relay; and the controller 60 is a PLC controller.

[0029] Such as figure 2 As shown, further, a fuse 70 for short-circuit protection is connected in series in the power suppl...

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PUM

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Abstract

The invention relates to a heating device in integrated circuit package equipment, in particular to a heating control device used for package equipment. The heating control device comprises a temperature measurement component, wherein an output end of the temperature measurement component is connected with an input end of a temperature control module; an output end of the temperature control module is connected with a relay; and a heating component is arranged in a power supply return circuit of a control end of the relay. According to the heating device, temperature control is separated from a processing range of a system PLC (Programmable Logic Controller), so that the temperature control is not interfered by factors such as PLC abnormity any more, and the stability and the precision of a temperature are ensured; in addition, an added short-circuit protection function facilitates protecting hardware; and a broken line detection function of the heating control device can give an alarm prompt at an early fault stage, so that a fault can be found conveniently and timely.

Description

technical field [0001] The invention relates to a heating device in integrated circuit packaging equipment, in particular to a heating control device for packaging equipment. Background technique [0002] Integrated circuit packaging equipment is high-precision and high-automation equipment. Its core part is the press used for packaging, and the accuracy of temperature control will directly affect the quality of packaging products. At present, the commonly used temperature control device mainly uses the temperature acquisition module to collect the current temperature, and uses the PID algorithm of its own temperature control to control the temperature. The disadvantages of adopting the above method are: firstly, when an error occurs in the temperature control device, the PID algorithm will stop working, causing the temperature to be in an uncontrollable state, and thus the phenomenon of product scrapping is very likely to occur; secondly, the control accuracy of the tempera...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G05D23/22H01L21/67
Inventor 方唐利汪辉胡鹏
Owner TONGLING FUSHI SANJIA MACHINE
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