Rigid-flex printed circuit board and manufacturing method thereof

A printed circuit board and printed circuit technology, which is applied to printed circuit components, structural connection of printed circuits, and printed circuit assembly of electrical components, which can solve the difficulty of graphic alignment, large changes in graphic positions, and difficulty in expansion and contraction Control and other issues to achieve the effect of improving the alignment accuracy of graphics, easy control of expansion and contraction, and improving the dimensional accuracy of milling and cutting

Active Publication Date: 2016-05-11
SHANGHAI MEADVILLE ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the printed circuit flexible board 10 is thin and soft, it is easy to deform, and the expansion and contraction are not easy to control. After pressing with the printed circuit hard board, the graphic position changes relatively greatly.
As a result, the drilling precision of the subsequent first printed circuit rigid board 3 and the second printed circuit rigid board 5 is low, making it difficult to make graphic alignment, and the yield rate is low

Method used

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  • Rigid-flex printed circuit board and manufacturing method thereof
  • Rigid-flex printed circuit board and manufacturing method thereof
  • Rigid-flex printed circuit board and manufacturing method thereof

Examples

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Embodiment Construction

[0034] The present invention is described in detail below in conjunction with accompanying drawing:

[0035] Such as figure 2 As shown, it is a rigid-flex printed circuit board, which includes a first printed circuit flexible board 1, a first adhesive layer 2, a first printed circuit rigid board 3, a second adhesive layer 4 and a second printed circuit board from top to bottom. Line hard board 5. The first printed circuit flexible board 1 includes a third copper foil layer 12 and a third polymer material layer 13 , and the third copper foil layer 12 has an exposed area 14 . The first printed circuit rigid board 3 includes a first copper foil layer 33 and a first polymer material layer 34 . The second printed circuit rigid board 5 includes a second copper foil layer 52 and a second polymer material layer 53 . The first copper foil layer 33 is arranged between the first printed circuit flexible board 1 and the first polymer material layer 34; the second polymer material laye...

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Abstract

The invention discloses a soft-hard combined printed circuit board, which is characterized by comprising at least one layer of soft printed circuit board and at least one layer of hard printed circuit board, wherein the soft printed circuit board is arranged on one side of the hard printed circuit board. According to the soft-hard combined printed circuit board provided by the invention, a structure in which the soft printed circuit board is arranged on one side the hard printed circuit board is adopted, so that the manufacturing difficulty of the soft-hard combined printed circuit board is lowered, the graph counterpoint accuracy between the soft printed circuit board and the hard printed circuit board is increased, and the production yield of the soft-hard combined printed circuit board is increased.

Description

technical field [0001] The invention relates to the field of printed circuit board manufacturing, in particular to a soft-rigid printed circuit board and a manufacturing method thereof. Background technique [0002] To put it simply, a Rigid-Flex Circuit Board is a circuit board that combines a printed circuit flexible board and a printed circuit hard board into the same product. It has both the flexibility of a flexible circuit board and the strength of a rigid circuit board. The early uses were mostly in the fields of military, medical, and industrial instruments. In recent years, they have been used in terminal products such as mobile phones and consumer electronics (digital cameras, digital cameras, etc.). In the application of soft-hard printed circuit boards in mobile phones, the common ones are image modules, button modules and radio frequency modules of folding mobile phones. The advantages of using rigid-flex printed circuit boards in mobile phones include easier ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/14H05K3/36
Inventor 瞿长江黄伟郑玉龙何海洋
Owner SHANGHAI MEADVILLE ELECTRONICS
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