Ceramic multilayered substrate and manufacturing method for same

Abstract

A ceramic multilayer substrate includes a ceramic substrate including a plurality of ceramic layers and electrodes (surface electrodes and internal electrodes) disposed on or in the ceramic layers, which are stacked on each other. A recessed portion is defined on a principal surface of any of the ceramic layers by the electrode and the surrounding ceramic layer. The electrodes (surface electrodes and internal electrodes) are buried or embedded in the ceramic layers. A peripheral portion of the surface electrode is preferably covered with a covering ceramic layer so as to prevent short-circuiting between adjacent electrodes even if surface electrodes and internal electrodes are disposed at narrow intervals and at high density.

Description

technical field [0001] The present invention relates to a ceramic multilayer substrate and a manufacturing method thereof. Specifically, it relates to a ceramic multilayer substrate including at least one of internal electrodes and surface electrodes and a manufacturing method thereof. Background technique [0002] A ceramic multilayer substrate generally has a structure in which electrodes (surface electrodes, internal electrodes) are provided on the surface and inside of a ceramic substrate (substrate main body) in which a plurality of ceramic layers are laminated. [0003] In such a ceramic multilayer substrate, along with the further miniaturization, it is necessary to arrange surface electrodes and internal electrodes at a high density at narrow intervals, and there is a possibility of short-circuiting between adjacent surface electrodes or between internal electrodes. question. [0004] As a method for solving such a problem, the following method of manufacturing a ce...

AI Technical Summary

Problems solved by technology

[0005] However, in the method of Patent Document 1, even if the bleeding of the entire pattern to be the surface electrode and the internal electrode formed by printing the conductive paste can be suppressed, it is difficult to prevent sudden local bleeding or splashing.

This partial electrode bleeding or splashing is caused by the detour of the pattern on the printing machine, release from the plate, etc., and sometimes it cannot be avoided even if the conductive paste itself is changed.

In addition, even if the printing pattern or printing machine is improved, in the mass production process, localized and sudden bleeding or splashing is sometimes unavoidable in practice

Images