Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Capacitive MEMS acceleration sensor

An acceleration sensor, acceleration sensing technology, applied in the measurement of acceleration, multi-dimensional acceleration measurement, speed/acceleration/impact measurement, etc., can solve the problems of tube shell rupture, lead breakage, poor packaging reliability, etc., to reduce cutting and wire bonding. Difficulty, increased sensitivity of induction, protection against mechanical damage

Active Publication Date: 2013-11-27
苏州明皜传感科技股份有限公司
View PDF3 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Practice has shown that the existing sensor packaging technology generally has the problems of poor resistance to high overload, low natural frequency, and poor packaging reliability. , there are often problems such as shell cracking, cover plate depression, chip falling off from the shell substrate, lead wire breakage, etc.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Capacitive MEMS acceleration sensor
  • Capacitive MEMS acceleration sensor
  • Capacitive MEMS acceleration sensor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0032] Embodiment: a capacitive MEMS acceleration sensor, comprising a MEMS acceleration chip 1, a signal processing chip 2 and a substrate 3 for filtering interference signals and processing induction signals, the MEMS acceleration chip 1 is composed of a cover body 4, a micromechanical system 5 and a circuit substrate 6 for generating induction signals, the micromechanical system 5 is composed of an X-axis acceleration sensing area 7, a Y-axis acceleration sensing area 8, and a Z-axis acceleration sensing area 9 for sensing external Z-axis motion, the said The cover body 4 and the circuit substrate 6 are bonded by a sealant layer 10 to form a sealed cavity 11. The micromechanical system 5 is located in the sealed cavity 11 and on the upper surface of the circuit substrate 6. The height of the sealed cavity 11 is 45~55μm;

[0033]The X-axis acceleration sensing area 7 includes an X-direction "H"-shaped moving piece 71 with two through holes, two X-direction moving electrodes ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Heightaaaaaaaaaa
Heightaaaaaaaaaa
Login to View More

Abstract

The invention discloses a capacitive MEMS acceleration sensor which comprises an MEMS acceleration chip, a signal processing chip and a substrate. The MEMS acceleration chip comprises a cover body, a micromechanical system and a circuit substrate. The micromechanical system is composed of an X-axis acceleration induction area, a Y-axis acceleration induction area and a Z-axis acceleration induction area. The Y-axis acceleration induction area comprises a Y-direction 'H'-shaped moving sheet provided with two through holes, two Y-direction moving electrodes and two Y-direction fixed electrodes. The Z-axis acceleration induction area comprises a mass block and a supporting shaft used for supporting the center of the mass block. The lower surface of the circuit substrate is bonded with a partial area on the upper surface of the signal processing chip through a first insulation adhesive layer. The upper surface of the circuit substrate is provided with a plurality of chip welding points. The upper surface of the substrate is provided with a plurality of substrate welding points which are distributed in the edge areas on the two sides of the substrate. The upper surface of the signal processing chip is provided with signal input welding points and signal output welding points respectively. The capacitive MEMS acceleration sensor improves the reliability of a device and effectively reduces stress damage to the chips by external force.

Description

technical field [0001] The invention relates to the technical field of acceleration sensors, in particular to a capacitive MEMS acceleration sensor. Background technique [0002] MEMS acceleration sensors have attracted much attention due to their small size, light weight, low cost, and high reliability, especially in the fields of aerospace and weapon science, which have high requirements for the volume, quality, and reliability of devices. Application prospects. The research on acceleration sensors has developed rapidly in recent years, and high-range acceleration sensors with various performances and ranges have been reported one after another. However, the accelerometer has high requirements for high overload resistance and natural frequency. Usually, the high overload resistance is required to withstand hundreds of thousands of range impact loads, and the natural frequency is required to be as high as tens of kHz, or even hundreds of kHz. Therefore, in applications, M...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G01P15/125
CPCG01P15/125G01P15/18G01P2015/0831
Inventor 陈学峰钟利强杨小平
Owner 苏州明皜传感科技股份有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com