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Three-axis acceleration sensor

A shaft acceleration and acceleration sensing technology, applied in multi-dimensional acceleration measurement, acceleration measurement using inertial force, etc., can solve the problems of low natural frequency, poor packaging reliability, cover plate depression, etc., to improve sensitivity and prevent mechanical damage. , the effect of reducing the position

Active Publication Date: 2015-05-20
MIRAMEMS SENSING TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Practice has shown that the existing sensor packaging technology generally has the problems of poor resistance to high overload, low natural frequency, and poor packaging reliability. , there are often problems such as shell cracking, cover plate depression, chip falling off from the shell substrate, lead wire breakage, etc.

Method used

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Embodiment

[0032] Embodiment: a kind of three-axis acceleration sensor, comprises MEMS acceleration chip 1, is used for filtering the signal processing chip 2 of interference signal and processing induction signal and substrate 3, and described MEMS acceleration chip 1 is made up of cover body 4, micromechanical system 5 and A circuit substrate 6 for generating induction signals. The micromechanical system 5 is composed of an X-axis acceleration sensing area 7, a Y-axis acceleration sensing area 8, and a Z-axis acceleration sensing area 9 for sensing external Z-axis motion. The cover Body 4 and circuit substrate 6 are bonded by a sealant layer 10 to form a sealed cavity 11. The micromechanical system 5 is located in the sealed cavity 11 and on the upper surface of the circuit substrate 6. The height of the sealed cavity 11 is 45~55μm;

[0033]The X-axis acceleration sensing area 7 includes an X-direction "H"-shaped moving piece 71 with two through holes, two X-direction moving electrodes...

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Abstract

The invention discloses a three-axis acceleration sensor which comprises an MEMS accelerated speed chip, a signal processing chip and a substrate. The MEMS accelerated speed chip comprises a cover body, a micro mechanical system and a circuit substrate, and the micro mechanical system is composed of an X axis accelerated speed induction area, a Y axis accelerated speed induction area and a Z axis accelerated speed induction area; the Y axis accelerated speed induction area comprises an H-shaped motion piece with two through holes in the Y direction, two motion electrodes in the Y direction and two fixed electrodes in the Y direction; the Z axis accelerated speed induction area comprises quality strip bars and a supporting shaft; the lower surface of the signal processing chip is pasted with the surface of the cover body of the MEMS accelerated speed chip through a first insulated adhesive layer, the circuit substrate of the MEMS accelerated speed chip is pasted with part of the substrate area through a second insulated adhesive layer, a first metal wire is arranged between a chip welding point and a signal inputting welding point in a spanning mode, and a second metal wire is arranged between a signal output welding point and a substrate welding point in a spanning mode. The three-axis acceleration sensor improves the reliability of appliances and effectively reduces stress damage to the chip by external force.

Description

technical field [0001] The invention relates to the technical field of acceleration sensors, in particular to a three-axis acceleration sensor. Background technique [0002] MEMS acceleration sensors have attracted much attention due to their small size, light weight, low cost, and high reliability, especially in the fields of aerospace and weapon science, which have high requirements for the volume, quality, and reliability of devices. Application prospects. The research on acceleration sensors has developed rapidly in recent years, and high-range acceleration sensors with various performances and ranges have been reported one after another. However, the accelerometer has high requirements for high overload resistance and natural frequency. Usually, the high overload resistance is required to withstand hundreds of thousands of range impact loads, and the natural frequency is required to be as high as tens of kHz, or even hundreds of kHz. Therefore, in applications, MEMS h...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01P15/18
Inventor 陈学峰钟利强杨小平
Owner MIRAMEMS SENSING TECH CO LTD
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