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Transformer coil film wrapping and sintering process

A transformer coil and thin film technology, which is applied in coil manufacturing, conductor/cable insulation, electrical components, etc., can solve problems such as inability to sinter and deposit, poor insulation performance, and easy cracking, so as to improve insulation and stability, improve Adhesion, the effect of preventing cracking

Inactive Publication Date: 2013-11-27
ANHUI KELIN ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Electromagnetic wire is the basic material industry for motors, electrical appliances, point addition, electronic information, communications and other industries. The electromagnetic wire is mainly enameled wire. The enameled wire is prone to pinholes, narrow edges, uneven coating, and bending during processing. Easy to crack when folded
At present, film-covered wires are gradually replacing traditional enameled wires as electromagnetic wires, but the existing film-covered wires have the following defects: they cannot be sintered and welded on the conductor completely and uniformly, easily cause cracks, poor adhesion, and poor insulation performance. solve

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0015] S1, removing the oxide layer on the surface of the copper wire.

[0016] Specifically, the oxide layer on the surface of the copper wire can be removed by mechanical processing, or the oxide layer on the surface of the copper wire can be removed by soaking and dissolving in a chemical solvent. The adhesion between the oxide layer and the copper body is not enough. Early removal will affect the bonding force between the subsequent outer cladding and the copper body.

[0017] S2, polishing the outer wall of the copper wire.

[0018] Specifically, the burr on the surface wall of the copper wire is mainly removed by means of mechanical processing, and the surface of the copper body is smoothed, thereby increasing the bonding force between the outer cladding layer and the copper body.

[0019] S3, wrapping a polyimide tape on the surface of the copper wire.

[0020] Specifically, the polyimide tape is evenly wound on the surface of the copper wire.

[0021] S4. Make the...

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PUM

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Abstract

The invention discloses a transformer coil film wrapping and sintering process, comprising the following steps of: removing an oxidation layer on the surface of a copper wire; polishing the outer wall of the copper wire; winding a polyimide wrapping belt on the surface of the copper wire; and enabling the copper wire to pass through a high-frequency spiral induction coil and heat, and controlling a difference value between an instant temperature of the copper wire and a temperature threshold to be within a certain range when the instant temperature of the copper wire reaches the preset temperature threshold. In the transformer coil film wrapping and sintering process, the film can be fully wrapped and evenly sintered and deposited on the copper wire, the adhesiveness of the film wrapping is increased, the coil is prevented from generating a cracking phenomenon when the coil is wound, thereby effectively improving the insulativity and stability of the film wire.

Description

technical field [0001] The invention relates to the technical field of transformer coils, in particular to a sintering process for transformer coil film wrapping. Background technique [0002] Electromagnetic wire is the basic material industry for motors, electrical appliances, point addition, electronic information, communications and other industries. The electromagnetic wire is mainly enameled wire. The enameled wire is prone to pinholes, narrow edges, uneven coating, and bending during processing. Easy to crack when folded. At present, film-covered wires are gradually replacing traditional enameled wires as electromagnetic wires, but the existing film-covered wires have the following defects: they cannot be sintered and welded on the conductor completely and uniformly, easily cause cracks, poor adhesion, and poor insulation performance. solve. Contents of the invention [0003] Aiming at the problems existing in the prior art, the present invention proposes a transf...

Claims

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Application Information

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IPC IPC(8): H01B13/00H01B13/10H01B13/26H01F41/12
Inventor 周俊徐叔平
Owner ANHUI KELIN ELECTRONICS
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