Manufacturing method of isolation type COB light source module

Abstract

The invention discloses a manufacturing method of an isolation type COB light source module. The manufacturing method of the isolation type COB light source module comprises the steps of crystal fixing, namely a crystal fixing position on a substrate is coated with liquid crystal fixing glue, an LED chip is attached to the crystal fixing position, and then the substrate is roasted; wire welding, namely one end of a gold wire is welded on a welding disc of the crystal fixing position, and the other end of the gold wire is welded on the electrode of the LED chip; surrounding dam installing, namely organic silica gel is dispersed on the substrate to form an annular surrounding dam; silica gel isolating layer manufacturing, namely liquid silica gel is dropped in the surrounding dam, and the substrate is roasted to enable the liquid silica gel to be solidified to form a silica gel isolating layer; silica gel fluorescent layer manufacturing, namely fluorescent powder and the liquid silica gel are evenly mixed to obtain liquid fluorescent silica gel, the liquid fluorescent silica gel is dropped onto the silica gel isolating layer, and the substrate is roasted to enable the liquid fluorescent silica gel to be solidified to form a silica gel fluorescent layer. The manufacturing method of the isolation type COB light source module has the advantages that the service life of the LED chip can be prolonged and light emitting quality can be optimized.

Description

[0001] technical field [0002] The invention relates to a manufacturing method of an isolated COB light source module. [0003] Background technique [0004] The COB light source produced by the traditional COB light source module production method generally includes a plurality of blue LED chips, and the LED chips are covered with a yellow phosphor silica gel layer. The blue light emitted by the blue LED chip excites the yellow phosphor to emit yellow-green light, and the yellow-green light is mixed with the blue light emitted by the blue LED chip to form white light. The LED chip is in direct contact with the phosphor powder. Since the LED chip itself is a heat generating body during use, the phosphor powder is affected by heat during long-term use, resulting in serious light attenuation, thereby affecting the quality of the LED. In addition, during the use of the LED chip, the phosphor powder excited by the blue light will cause energy loss, and then generate heat. Thi...

AI Technical Summary

Problems solved by technology

The LED chip is in direct contact with the phosphor powder. Since the LED chip itself is a heating element, the phosphor powder will be affected by heat during long-term use, resulting in serious light decay, which affects the quality of the LED.

In addition, during the use of the LED chip, the phosphor powder excited by the blue light will cause energy loss, and then generate heat. This heat and the heat generated by the LED chip will accumulate in the silica gel layer of the phosphor powder. The temperature of the silicone layer can be as high as 220°C, which will greatly affect the life and quality of the LED chip

This thermal effect reduces the quantum efficiency of the phosphor, which in turn affects the overall luminous efficiency

In addition, air remains in the phosphor silica gel layer produced by the traditional COB light source module manufacturing method, resulting in multiple air bubbles in the phosphor silica gel layer, which affects the optical quality of the COB light source

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