PCB board moulding processing method and laminated plate

A PCB board and forming processing technology, applied in the direction of printed circuit, electrical components, printed circuit manufacturing, etc., can solve the problems of increasing product processing cost, difficulty in mass production, poor processing effect, etc., to achieve reduced processing cost, easy operation, Guaranteed quality effect

Inactive Publication Date: 2013-12-04
NEW FOUNDER HLDG DEV LLC +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the manual repair method is not only inefficient, but also increases the processing cost of the product, and the processing effect is poor, and it also makes it difficult to achieve mass production.

Method used

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  • PCB board moulding processing method and laminated plate
  • PCB board moulding processing method and laminated plate
  • PCB board moulding processing method and laminated plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] The PCB board to be formed includes an effective area and an edge area. The effective area contains at least one forming area. The forming process of the PCB is to remove the non-forming area on the PCB to be formed, leaving only the forming area.

[0041] In this embodiment, the effective area only includes one molding area 7 (ie image 3 The area on the PCB board to be formed corresponding to the forming circuit 3 on the middle support plate), that is, the range of the effective area completely overlaps with the range of the forming area. The forming line 3 here is not really set on the support plate, it is actually only preset in the processing program of the milling machine, image 3 The purpose of marking in is to facilitate readers to distinguish the effective area (molding area) and edge area of ​​the PCB board to be formed.

[0042] In this embodiment, the PCB board 1 to be formed adopts a high-frequency high-speed FPC board, that is, a flexible printed circuit...

Embodiment 2

[0062] The difference between this embodiment and Embodiment 1 is that the effective area of ​​the PCB board to be formed includes N molding areas 7, that is, in the laminated board formed after the support plate and the PCB board to be formed are laminated, as Figure 4 As shown, the N molding regions 7 in the laminated board will form N small unit PCBs correspondingly after molding.

[0063] In this embodiment, a positioning unit is provided on the formed laminated board. The positioning unit includes a first positioning unit and N second positioning units.

[0064] The structure and opening position of the first positioning unit are exactly the same as those in Embodiment 1, and will not be described in detail here.

[0065] In this embodiment, among the N forming areas 7 in the laminated board, each forming area 7 is provided with a second positioning unit. The second positioning unit in each molding area 7 includes the second positioning hole 6 arranged in the molding a...

Embodiment 3

[0069] The difference between this embodiment and Embodiment 1 is that only one support plate is used in this embodiment, that is, only the first base material plate 4 or the second base material plate 5 is included, that is to say, only the PCB board to be formed 1, a support plate is set on one of the sides.

[0070] The laminated board in this embodiment includes a PCB board to be formed and a supporting board, and the supporting board is laminated on one side of the PCB board to be formed. Wherein, a first positioning hole is opened in the edge area of ​​the PCB board to be formed, and a second positioning hole is opened in its effective area; a first alignment hole is opened on the position corresponding to the first positioning hole on the support plate. A second alignment hole is opened at a position corresponding to the second positioning hole.

[0071] The forming and processing method of the PCB board to be formed in this embodiment is the same as that in Embodiment...

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Abstract

The invention provides a PCB board moulding processing method. The method comprises the following steps that: a support plate is obtained; plate lamination of the support plate and a to-be-moulded PCB board is carried out and after the plate lamination, the support plate and the to-be-moulded PCB board form a laminated plate; and moulding processing is carried out on the laminated plate, so that the to-be-moulded PCB board forms a PCB board. According to the method, plate edge burrs of the PCB board can be effectively reduced or eliminated during the PCB moulding processing process; the manufacturing process is simple and convenient; the processing efficiency is improved; and the quality of the PCB board after the moulding can be ensured.

Description

technical field [0001] The invention belongs to the technical field of printed circuit boards, and relates to a method for forming and processing a PCB board and a laminated board. The method is particularly suitable for processing PCB boards made of high-frequency materials. Background technique [0002] With the development of miniaturization, digitalization and high integration of electronic products, its signal transmission is also becoming increasingly high-frequency and high-speed, and higher performance and quality of PCB (Printed Circuit Board: printed circuit board) are also proposed. requirements, especially for high-frequency and high-speed FPC (Flexible Printed Circuit) boards represented by optoelectronic products. There are also strict requirements on its processing. [0003] At present, the high-frequency FPC board generally uses polytetrafluoroethylene material as the production material. After the wiring and drilling process in the effective area of ​​the h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
Inventor 蔡童军李金鸿胡新星
Owner NEW FOUNDER HLDG DEV LLC
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