Grinding machine thickness measuring device and grinding machine

Abstract

The invention provides a thickness measurement device of a scrubbing machine; and the device is high in accuracy and working efficiency. The invention also provides the scrubbing machine provided with the thickness measurement device. The scrubbing machine comprises a programmable logic controller (PLC), a brush roll, a brush roll fixing seat, a brush roll motor, a pressure adjusting box, a servo motor, a pressure regulating screw rod and the thickness measurement device, wherein the brush roll is driven to rotate by the brush roll motor; the servo motor can be used for adjusting the position of the brush roll fixing seat by controlling the threaded connection height between the pressure regulating screw rod and the pressure adjusting box; the thickness measurement device mainly comprises a thickness measurement rotating shaft, a thickness measurement rubber roll, a rotary encoder, a big synchronizing wheel and a small synchronizing wheel; when a base plate enters the position between the thickness measurement rubber roll and a lower carrier roller, the big synchronizing wheel and the small synchronizing wheel are driven to rotate by the thickness measurement rotating shaft; the rotary encoder connected with the small synchronizing wheel is used for transmitting the spin data into the PLC; the PLC is used for controlling the rotating speed of the servo motor and the brush roll motor. The scrubbing machine and the thickness measurement device of the scrubbing machine are applied to the processing field of a circuit board.

Description

technical field [0001] The invention relates to a plate grinder thickness measuring device and a plate grinder which can be applied in the field of circuit board processing. Background technique [0002] With the development of science and technology and the progress of society, circuit boards have been applied in more and more fields. In the process of making circuit boards, it is an essential process step to use a grinding machine to treat the surface of the circuit board. This step is to grind off the oxide layer on the surface of the circuit board and strengthen the copper surface and dry film. The binding force between them, but in the actual grinding process, the position of the brush wheel needs to be adjusted according to the actual thickness of the circuit board. Most grinding machines on the market require the operator to manually set the thickness. This method not only The work efficiency is low, and there is a large deviation between the set value and the actual...

AI Technical Summary

Problems solved by technology

However, the existing thickness measuring devices still have the following defects: 1. The measurement accuracy is low, and the accuracy difference is ≥ 100um

Moreover, the analog sensor can only accurately measure the plate thickness in a small thickness variation range. When the plate thickness is large or small, the measured value is seriously distorted and cannot adapt to a wide range of production needs; 2. The mechanical stroke of the prior art is short and can The measurement range is small; 3. The analog signal is susceptible to electromagnetic interference from the actual environment on site, which eventually leads to the following phenomena: a. The deviation between the measured value and the actual value is large; b. With the change of the external environment such as the temperature and humidity of the production site, the simulation The full working domain response curve of the volume signal sensor will be distorted, resulting in low repeatability of the thickness measuring device; c. The price of the analog signal sensor is high, and the production cost is high; d. After each new machine is produced, it needs to be simulated. Quantity sensor should be accurately debugged according to the installation position, and the parameters of the analog to digital conversion module should also be debugged, otherwise the thickness measurement value will deviate too much from the actual value, which will affect the product quality. Therefore, the production of prior art products, Debugging and maintenance process is extremely complicated

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