Method for cutting silicon ingot

Abstract

The invention relates to a method for cutting a silicon ingot, which belongs to the technical field of processing solar photovoltaic silicon ingots. The method for cutting the silicon ingot has the technical scheme that (1) the silicon ingot is put into a tray, and a positioning block of a positioning fixture is adjusted, so that the distance between the positioning block and the edge of the tray is consistent; (2) a positioning line is marked on the silicon ingot by using the edge of the positioning fixture on the silicon ingot as a benchmark; (3) when the silicon ingot is put on a machine and aligned to be cut, the position of a wire mesh of a cutter coincides with the positioning line. According to the method for cutting the silicon ingot, when the silicon ingot is squared to be cut, the position of the wire mesh of the cutter coincides with the positioning line, so that an ingot body can be equally divided, and all crucible surface ingots can be kept away from the edge of the silicon ingot, thereby integrally prolonging the service life of a minority carrier of the squared silicon ingot, increasing the effective stick length of the silicon ingot and stabilizing the primary utilization rate of silicon and the quality of recycled materials.

Description

technical field [0001] The invention belongs to the technical field of solar photovoltaic silicon ingot processing, and in particular relates to a method for cutting a silicon ingot. Background technique [0002] In the process of silicon material processing, silicon ingot squaring is a key process before silicon material cutting. Wire saw or band saw is often used for silicon ingot squaring to cut the whole silicon ingot into cuboids of certain specifications. [0003] In the field of squaring photovoltaic silicon ingots, most of them use wire saws. The cutting principle is that the position of the ingot is fixed, and the wire mesh is used for downward pressure cutting. In today's trend of continuous pursuit of silicon wafer conversion efficiency, improving the quality of the prescription will directly affect the primary utilization rate of silicon materials, the effective utilization rate of silicon material recovery and the conversion efficiency of silicon wafers. At pre...

AI Technical Summary

Problems solved by technology

At present, in the mode of using the mortar line square root, the cutting position of the silicon ingot deviates, and the ingot on the side of the crucible surface has a decrease in the overall lifetime value of the minority carrier, which directly leads to a decrease in the effective length of the silicon ingot, so that the silicon material reduction in primary utilization

The conversion efficiency of silicon wafers processed from the silicon ingot is reduced

The scrap scrap produced by cutting the silicon ingot will affect the stability of the conversion efficiency of the furnace ingot

Images