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An instrument for measuring flatness of LED substrate wafer processing disk surface

A measuring instrument and wafer processing technology, applied in the direction of instruments, measuring devices, etc., to achieve the effect of improving product quality, improving efficiency, and ensuring the flatness of the disk surface

Active Publication Date: 2016-03-30
CHANGZHOU C PE PHOTO ELECTRICITY SCI & TECHN
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  • Abstract
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  • Claims
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Problems solved by technology

[0003] The present invention aims to solve the technical and technological problems of the substrate grinding disk surface measuring instrument, and ensure that the precision tolerance of the disk surface is controlled within ±1 μm

Method used

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  • An instrument for measuring flatness of LED substrate wafer processing disk surface
  • An instrument for measuring flatness of LED substrate wafer processing disk surface

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Embodiment Construction

[0013] The invention will now be described in further detail in conjunction with the accompanying drawings and preferred embodiments. These drawings are all simplified schematic diagrams, which only illustrate the basic structure of the present invention in a schematic manner, so they only show the configurations related to the present invention.

[0014] refer to Figure 1 to Figure 2 As shown, 7 groups of test points are distributed on the disk surface flatness measuring instrument disclosed by the present invention, and each group of test points includes TTV accuracy and wafer thickness test points, and the LED substrate wafer is placed on the reference workbench (the workbench has vertical and horizontal To move the petals), the measuring instrument will test each measuring point in turn to detect the flatness of the processing disc.

[0015] What is described in the above description is only the specific implementation of the present invention, and various illustrations ...

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Abstract

The invention discloses LED substrate wafer processing disc surface flatness measuring instrument design. The LED substrate wafer processing disc surface flatness measuring instrument design is composed of a plurality of steps, and comprises appearance principle design, instrument manufacturing material selection, a stress test and a compressive strength test, wherein the appearance principle design comprises the whole appearance design of an instrument and the test principle design of the instrument, stress and compressive strength ability of the instrument are improved through instrument disc surface manufacturing material selection to ensure that the disc surface precision of a substrate wafer is controlled to range from -1micron to 1micron, and therefore the quality of the substrate wafer is improved, manufacturing cycle is shortened, production cost is saved, and the purpose of improving labor productivity is also achieved.

Description

technical field [0001] The invention relates to the technical field of designing an instrument for measuring the flatness of a grinding disk surface for LED substrate wafer processing, in particular to a method for designing a measuring instrument for the flatness of a disk surface. Background technique [0002] With the proposal of energy saving, emission reduction and green energy, the processing of sapphire as a substrate for light-emitting devices has become the focus of research. Due to its high hardness and high brittleness, machining is difficult. The sapphire substrate is currently the most common substrate material. Wafer TTV control requirements are very strict, and the mechanism of sapphire mechanical grinding and the design technology of measuring instruments for flatness of substrate wafer processing have become important problems to be solved urgently. Contents of the invention [0003] The invention aims to solve the technical and technological problems of ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01B21/30
Inventor 潘相成
Owner CHANGZHOU C PE PHOTO ELECTRICITY SCI & TECHN
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