Integrated packaging structure of surface acoustic wave filter and packaging method thereof

Abstract

The invention discloses an integrated packaging structure of a surface acoustic wave filter and a packaging method thereof and belongs to the technical field of surface acoustic waves. The integrated packaging structure comprises a surface acoustic wave filter chip, a matching tuned circuit and a packaging shell. The packaging shell is composed of a packaging base, outer pins of the packaging base, and a sealing cap. The sealing cap covers the packaging base. The integrated packaging structure is characterized in that a tuned substrate is arranged, the matching tuned circuit is manufactured on the tuned substrate, the surface acoustic wave filter chip is adhered to the tuned substrate and is electrically connected with the matching tuned circuit through a bonding wire, and the tuned substrate is adhered to the packaging base and is electrically connected with the outer pins of the packaging base through bonding wires. According to the integrated packaging structure, the surface acoustic wave filter chip and the matching tuned circuit are integrated and packaged in the same packaging body, so that mutual connection structures between the surface acoustic wave filter chip and an application circuit, and between the matching tuned circuit and an application circuit are simplified. Consequently, the integrated packaging structure has the advantages of being compact in structure, small in consumption, strong in antijamming capability, and the like, and helps to improve the overall performance of an application system of a surface acoustic wave filter.

Description

technical field [0001] The invention relates to an electronic packaging structure and packaging method, in particular to an integrated packaging structure and packaging method of a surface acoustic wave filter, belonging to the technical field of surface acoustic wave. Background technique [0002] When the surface acoustic wave filter is connected to the application circuit, it is often necessary to set a tuning circuit between it and the front and rear circuits to achieve the matching of the electrical parameters between the device and the front and rear circuits, so as to exert the best performance of the surface acoustic wave filter. performance. The surface acoustic wave filter in the prior art generally adopts an independent packaging method, that is, each filter chip is placed in a package shell separately, and the matching tuning circuit is arranged outside the device package. The disadvantages brought about by this are The structure of the interconnection between t...

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Problems solved by technology

[0003] The purpose of the present invention is to overcome above-mentioned deficiencies in the prior art, overcome the surface acoustic wave filter chip and the matching tuner circuit in the prior art to separate inside and outside the package, the interconnection wire structure is complex, the loss is large, and the anti-interference ability is poor, and then The shortcomings that have a significant adverse effect on the overall performance of the surface acoustic wave filter application system, thereby providing an integrated packaging structure and packaging method for the surface acoustic wave filter

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